Issued Patents All Time
Showing 26–50 of 84 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741365 | Low volume showerhead with porous baffle | Ramesh Chandrasekharan, Saangrut Sangplung, Frank L. Pasquale, Hu Kang, Adrien LaVoie | 2020-08-11 |
| 10741458 | Methods for depositing films on sensitive substrates | Hu Kang, Adrien LaVoie, Jon Henri | 2020-08-11 |
| 10665429 | Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformity | Hu Kang, Adrien LaVoie, Jun Qian, Chloe Baldasseroni, Frank L. Pasquale +8 more | 2020-05-26 |
| 10648079 | Reducing backside deposition at wafer edge | Chloe Baldasseroni, Andrew Duvall, Ryan Blaquiere | 2020-05-12 |
| 10629435 | Doped ALD films for semiconductor patterning applications | Richard Phillips, Adrien LaVoie | 2020-04-21 |
| 10622243 | Planar substrate edge contact with open volume equalization pathways and side containment | Patrick Breiling, Ramesh Chandrasekharan, Karl Leeser, Paul Konkola, Adrien LaVoie +7 more | 2020-04-14 |
| 10559468 | Capped ALD films for doping fin-shaped channel regions of 3-D IC transistors | Reza Arghavani, Samantha Tan, Bhadri N. Varadarajan, Adrien LaVoie, Ananda Banerji +1 more | 2020-02-11 |
| 10541117 | Systems and methods for tilting a wafer for achieving deposition uniformity | Pramod Subramonium, Frank L. Pasquale, Jeongseok Ha, Chloe Baldasseroni | 2020-01-21 |
| 10526700 | Hardware and process for film uniformity improvement | Purushottam Kumar, Hu Kang, Adrien LaVoie, Yi Chung Chiu, Frank L. Pasquale +5 more | 2020-01-07 |
| 10529557 | Systems and methods for UV-based suppression of plasma instability | — | 2020-01-07 |
| 10418236 | Composite dielectric interface layers for interconnect structures | Kapu Sirish Reddy, Nagraj Shankar, Meliha Gozde Rainville, Frank L. Pasquale | 2019-09-17 |
| 10407773 | Methods and apparatuses for showerhead backside parasitic plasma suppression in a secondary purge enabled ALD system | Adrien LaVoie, Hu Kang, Purushottam Kumar, Jun Qian, Frank L. Pasquale +1 more | 2019-09-10 |
| 10403474 | Collar, conical showerheads and/or top plates for reducing recirculation in a substrate processing system | Richard Phillips, Ryan Blaquiere | 2019-09-03 |
| 10378107 | Low volume showerhead with faceplate holes for improved flow uniformity | Ramesh Chandrasekharan, Saangrut Sangplung, Frank L. Pasquale, Hu Kang, Adrien LaVoie +6 more | 2019-08-13 |
| 10361076 | Gapfill of variable aspect ratio features with a composite PEALD and PECVD method | Hu Kang, Jun Qian, Wanki Kim, Dennis M. Hausmann, Bart J. van Schravendijk +1 more | 2019-07-23 |
| 10323323 | Systems and methods enabling low defect processing via controlled separation and delivery of chemicals during atomic layer deposition | Ramesh Chandrasekharan, Jennifer O'Loughlin, Saangrut Sangplung, Frank L. Pasquale, Chloe Baldasseroni +1 more | 2019-06-18 |
| 10301718 | Asymmetric pedestal/carrier ring arrangement for edge impedance modulation | Ryan Blaquiere, Ramesh Chandrasekharan, Yukinori Sakiyama | 2019-05-28 |
| 10192742 | Soft landing nanolaminates for advanced patterning | Frank L. Pasquale, Adrien LaVoie, Nader Shamma, Girish Dixit | 2019-01-29 |
| 10157755 | Purge and pumping structures arranged beneath substrate plane to reduce defects | Ramesh Chandrasekharan, Adrien LaVoie | 2018-12-18 |
| 10134579 | Method for high modulus ALD SiO2 spacer | Chloe Baldasseroni | 2018-11-20 |
| 10109478 | Systems and methods for UV-based suppression of plasma instability | — | 2018-10-23 |
| 10100407 | Hardware and process for film uniformity improvement | Purushottam Kumar, Hu Kang, Adrien LaVoie, Yi Chung Chiu, Frank L. Pasquale +5 more | 2018-10-16 |
| 10074543 | High dry etch rate materials for semiconductor patterning applications | Arpan Mahorowala, Ishtak Karim, Purushottam Kumar, Adrien LaVoie | 2018-09-11 |
| 10049869 | Composite dielectric interface layers for interconnect structures | Kapu Sirish Reddy, Nagraj Shankar, Meliha Gozde Rainville, Frank L. Pasquale | 2018-08-14 |
| 10049911 | Temporally pulsed and kinetically modulated CVD dielectrics for gapfill applications | Frank L. Pasquale | 2018-08-14 |