Issued Patents All Time
Showing 76–84 of 84 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9287113 | Methods for depositing films on sensitive substrates | Hu Kang, Adrien LaVoie, Jon Henri | 2016-03-15 |
| 9257274 | Gapfill of variable aspect ratio features with a composite PEALD and PECVD method | Hu Kang, Jun Qian, Wanki Kim, Dennis M. Hausmann, Bart J. van Schravendijk +1 more | 2016-02-09 |
| 9230800 | Plasma activated conformal film deposition | Adrien LaVoie, Hu Kang, Ramesh Chandrasekharan, Tom Dorsh, Dennis M. Hausmann +9 more | 2016-01-05 |
| 9214334 | High growth rate process for conformal aluminum nitride | Ananda Banerji, Nagraj Shankar, Adrien LaVoie | 2015-12-15 |
| 8999859 | Plasma activated conformal dielectric film deposition | Jon Henri, Dennis M. Hausmann, Pramod Subramonium, Mandyam Sriram, Vishwanathan Rangarajan +3 more | 2015-04-07 |
| 8956704 | Methods for modulating step coverage during conformal film deposition | Hu Kang, Adrien LaVoie | 2015-02-17 |
| 8956983 | Conformal doping via plasma activated atomic layer deposition and conformal film deposition | Mandyam Sriram, Bart J. van Schravendijk, Pramod Subramonium, Adrien LaVoie | 2015-02-17 |
| 8728956 | Plasma activated conformal film deposition | Adrien LaVoie, Hu Kang, Ramesh Chandrasekharan, Tom Dorsh, Dennis M. Hausmann +9 more | 2014-05-20 |
| 8637411 | Plasma activated conformal dielectric film deposition | Jon Henri, Dennis M. Hausmann, Pramod Subramonium, Mandyam Sriram, Vishwanathan Rangarajan +3 more | 2014-01-28 |