Issued Patents All Time
Showing 51–75 of 84 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10043657 | Plasma assisted atomic layer deposition metal oxide for patterning applications | Frank L. Pasquale, Adrien LaVoie | 2018-08-07 |
| 10043655 | Plasma activated conformal dielectric film deposition | Jon Henri, Dennis M. Hausmann, Pramod Subramonium, Mandyam Sriram, Vishwanathan Rangarajan +3 more | 2018-08-07 |
| 10008428 | Methods for depositing films on sensitive substrates | Hu Kang, Adrien LaVoie, Jon Henri | 2018-06-26 |
| 9997357 | Capped ALD films for doping fin-shaped channel regions of 3-D IC transistors | Reza Arghavani, Samantha Tan, Bhadri N. Varadarajan, Adrien LaVoie, Ananda Banerji +1 more | 2018-06-12 |
| 9970108 | Systems and methods for vapor delivery in a substrate processing system | Jun Qian, Hu Kang, Purushottam Kumar, Chloe Baldasseroni, Heather Landis +11 more | 2018-05-15 |
| 9920844 | Valve manifold deadleg elimination via reentrant flow path | Karl Leeser, Saangrut Sangplung, Frank L. Pasquale, Chloe Baldasseroni, Ted Minshall +1 more | 2018-03-20 |
| 9905423 | Soft landing nanolaminates for advanced patterning | Frank L. Pasquale, Adrien LaVoie, Nader Shamma, Girish Dixit | 2018-02-27 |
| 9892917 | Plasma assisted atomic layer deposition of multi-layer films for patterning applications | Frank L. Pasquale, Adrien LaVoie | 2018-02-13 |
| 9852901 | Systems and methods for reducing backside deposition and mitigating thickness changes at substrate edges | Sesha Varadarajan, Saangrut Sangplung, Frank L. Pasquale, Ted Minshall, Adrien LaVoie +2 more | 2017-12-26 |
| 9793110 | Gapfill of variable aspect ratio features with a composite PEALD and PECVD method | Hu Kang, Jun Qian, Wanki Kim, Dennis M. Hausmann, Bart J. van Schravendijk +1 more | 2017-10-17 |
| 9793096 | Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformity | Hu Kang, Adrien LaVoie, Jun Qian, Chloe Baldasseroni, Frank L. Pasquale +8 more | 2017-10-17 |
| 9786570 | Methods for depositing films on sensitive substrates | Hu Kang, Adrien LaVoie, Jon Henri | 2017-10-10 |
| 9698042 | Wafer centering in pocket to improve azimuthal thickness uniformity at wafer edge | Chloe Baldasseroni, Ted Minshall, Frank L. Pasquale, Ramesh Chandrasekharan | 2017-07-04 |
| 9673041 | Plasma assisted atomic layer deposition titanium oxide for patterning applications | Frank L. Pasquale, Adrien LaVoie | 2017-06-06 |
| 9631276 | Systems and methods enabling low defect processing via controlled separation and delivery of chemicals during atomic layer deposition | Ramesh Chandrasekharan, Jennifer O'Loughlin, Saangrut Sangplung, Frank L. Pasquale, Chloe Baldasseroni +1 more | 2017-04-25 |
| 9624578 | Method for RF compensation in plasma assisted atomic layer deposition | Jun Qian, Frank L. Pasquale, Adrien LaVoie, Chloe Baldasseroni, Hu Kang +7 more | 2017-04-18 |
| 9617638 | Methods and apparatuses for showerhead backside parasitic plasma suppression in a secondary purge enabled ALD system | Adrien LaVoie, Hu Kang, Purushottam Kumar, Jun Qian, Frank L. Pasquale +1 more | 2017-04-11 |
| 9570290 | Plasma assisted atomic layer deposition titanium oxide for conformal encapsulation and gapfill applications | Frank L. Pasquale, Adrien LaVoie | 2017-02-14 |
| 9570274 | Plasma activated conformal dielectric film deposition | Jon Henri, Dennis M. Hausmann, Pramod Subramonium, Mandyam Sriram, Vishwanathan Rangarajan +3 more | 2017-02-14 |
| 9508547 | Composition-matched curtain gas mixtures for edge uniformity modulation in large-volume ALD reactors | Frank L. Pasquale, Chloe Baldasseroni, Edward Augustyniak, Yukinori Sakiyama | 2016-11-29 |
| 9460915 | Systems and methods for reducing backside deposition and mitigating thickness changes at substrate edges | Sesha Varadarajan, Saangrut Sangplung, Frank L. Pasquale, Ted Minshall, Adrien LaVoie +2 more | 2016-10-04 |
| 9390909 | Soft landing nanolaminates for advanced patterning | Frank L. Pasquale, Adrien LaVoie, Nader Shamma, Girish Dixit | 2016-07-12 |
| 9373500 | Plasma assisted atomic layer deposition titanium oxide for conformal encapsulation and gapfill applications | Frank L. Pasquale, Adrien LaVoie | 2016-06-21 |
| 9355886 | Conformal film deposition for gapfill | Bart J. van Schravendijk, Adrien LaVoie, Sesha Varadarajan, Jason D. Park, Michal Danek +1 more | 2016-05-31 |
| 9355839 | Sub-saturated atomic layer deposition and conformal film deposition | Hu Kang, Adrien LaVoie | 2016-05-31 |