Issued Patents All Time
Showing 51–75 of 151 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9997373 | Technique to deposit sidewall passivation for high aspect ratio cylinder etch | — | 2018-06-12 |
| 9997372 | Technique to deposit sidewall passivation for high aspect ratio cylinder etch | Joseph Scott Briggs | 2018-06-12 |
| 9887069 | Controlling ion energy distribution in plasma processing systems | Andreas Fischer | 2018-02-06 |
| 9887097 | Technique to deposit sidewall passivation for high aspect ratio cylinder etch | — | 2018-02-06 |
| 9879546 | Airfoil cooling circuits | Tracy A. Propheter-Hinckley, San Quach, Matthew A. Devore | 2018-01-30 |
| 9803559 | Variable vane and seal arrangement | Andrew D. Burdick, Thomas J. Praisner, Andrew S. Aggarwala, Michael G. McCaffrey | 2017-10-31 |
| 9793126 | Ion to neutral control for wafer processing with dual plasma source reactor | Rajinder Dhindsa, Sang Ki Nam, Alexei Marakhtanov | 2017-10-17 |
| 9735020 | System, method and apparatus for plasma etch having independent control of ion generation and dissociation of process gas | — | 2017-08-15 |
| 9673058 | Method for etching features in dielectric layers | Scott Briggs, Leonid Belau, John Holland, Mark Wilcoxson | 2017-06-06 |
| 9620377 | Technique to deposit metal-containing sidewall passivation for high aspect ratio cylinder etch | Mark Wilcoxson, Kalman Pelhos, Hyung Joo Shin | 2017-04-11 |
| 9548186 | Methods and apparatus for dual confinement and ultra-high pressure in an adjustable gap plasma chamber | Andreas Fischer | 2017-01-17 |
| 9543158 | Technique to deposit sidewall passivation for high aspect ratio cylinder etch | Nikhil Dole | 2017-01-10 |
| 9543148 | Mask shrink layer for high aspect ratio dielectric etch | Mark Wilcoxson, Kalman Pelhos, Hyunjong Shim, Merrett Wong | 2017-01-10 |
| 9536711 | Method and apparatus for DC voltage control on RF-powered electrode | Rajinder Dhindsa, Alexei Marakhtanov, Maryam Moravej, Andreas Fischer | 2017-01-03 |
| 9418859 | Plasma-enhanced etching in an augmented plasma processing system | Andrew D. Bailey, III, Rajinder Dhindsa | 2016-08-16 |
| 9396961 | Integrated etch/clean for dielectric etch applications | Reza Arghavani, Shashank Deshmukh, Tom A. Kamp, Samantha Tan, Gerardo Delgadino | 2016-07-19 |
| 9384998 | Technique to deposit sidewall passivation for high aspect ratio cylinder etch | Dennis M. Hausmann, Joseph Scott Briggs | 2016-07-05 |
| 9385021 | Electronic knob for tuning radial etch non-uniformity at VHF frequencies | Zhigang Chen | 2016-07-05 |
| 9384979 | Apparatus for the deposition of a conformal film on a substrate and methods therefor | Dae-Han Choi, Jisoo Kim, Sangheon Lee, Conan Chiang, S. M. Reza Sadjadi | 2016-07-05 |
| 9378971 | Technique to deposit sidewall passivation for high aspect ratio cylinder etch | Joseph Scott Briggs | 2016-06-28 |
| 9287096 | Methods and apparatus for a hybrid capacitively-coupled and an inductively-coupled plasma processing system | Alexei Marakhtanov, Rajinder Dhindsa, Neil Benjamin | 2016-03-15 |
| 9263331 | Method for forming self-aligned contacts/vias with high corner selectivity | Ananth Indrakanti, Peng Wang | 2016-02-16 |
| 9263240 | Dual zone temperature control of upper electrodes | Alexei Marakhtanov, Rajinder Dhindsa, Ryan Bise, Lumin Li, Sang Ki Nam +5 more | 2016-02-16 |
| 9257300 | Fluorocarbon based aspect-ratio independent etching | Ranadeep Bhowmick | 2016-02-09 |
| 9251999 | Capacitively-coupled plasma processing system having a plasma processing chamber for processing a substrate | Rajinder Dhindsa, Alexei Marakhtanov, Andreas Fischer | 2016-02-02 |