Issued Patents All Time
Showing 25 most recent of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955434 | Ultra small molded module integrated with die by module-on-wafer assembly | Yoshihiro Tomita, Eric J. Li, Shawna M. Liff, Javier A. Falcon | 2024-04-09 |
| 11653467 | Modular system for internet of things and method of assembling the same | Chris D. Lucero, Khine Han, Christopher Rossi, Hadi Sharifi, Aniekeme Udofia +5 more | 2023-05-16 |
| 11135494 | Training aid support base and assembly | — | 2021-10-05 |
| 11024559 | Semiconductor package with electromagnetic interference shielding structures | Mitul Modi | 2021-06-01 |
| 10825714 | Stretching retention plate for electronic assemblies | Daniel Chavez-Clemente, Naida Duranovic | 2020-11-03 |
| 10820437 | Flexible packaging for a wearable electronic device | Aleksandar Aleksov, Son V. Nguyen, Rajat Goyal, David B. Lampner, Dilan Seneviratne +4 more | 2020-10-27 |
| 10707171 | Ultra small molded module integrated with die by module-on-wafer assembly | Tomita YOSHIHIRO, Eric J. Li, Shawna M. Liff, Javier A. Falcon | 2020-07-07 |
| 10672625 | Electronic device package with recessed substrate for underfill containment | Sergio Antonio Chan Arguedas, Jimin Yao | 2020-06-02 |
| 10636716 | Through-mold structures | Sasha N. Oster, Srikant Nekkanty, Adel A. Elsherbini, Yoshihiro Tomita, Debendra Mallik +2 more | 2020-04-28 |
| 10615128 | Systems and methods for electromagnetic interference shielding | Rajendra C. Dias, Anna M. Prakash, Eric J. Li, Nachiket R. Raravikar | 2020-04-07 |
| 10446461 | Complex cavity formation in molded packaging structures | Sasha N. Oster, Adel A. Elsherbini, Shawna M. Liff | 2019-10-15 |
| 10325866 | Electronic device packages with conformal EMI shielding and related methods | Eric J. Li, Rajendra C. Dias, Mitul Modi | 2019-06-18 |
| 10224290 | Electromagnetically shielded electronic devices and related systems and methods | Rajendra C. Dias, Takashi Kumamoto, Yoshishiro Tomita, Mitul Modi, Eric J. Li | 2019-03-05 |
| 10205292 | Socket contact techniques and configurations | Dhanya Athreya, Gaurav Chawla, Kemal Aygun, Glen P. Gordon, Sarah M. Canny +3 more | 2019-02-12 |
| 10193493 | Multi-surface solar cell packaging for self-powered electronic devices | Debendra Mallik | 2019-01-29 |
| 10111368 | Flexible substrate retention on a reusable carrier | Yoshihiro Tomita | 2018-10-23 |
| 10070520 | Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrier | Yoshihiro Tomita, Shawna M. Liff, Pramod Malatkar | 2018-09-04 |
| 10056182 | Surface-mount inductor structures for forming one or more inductors with substrate traces | Gregorio R. Murtagian, Robert L. Sankman, Brent Stone, Kaladhar Radhakrishnan | 2018-08-21 |
| 9991211 | Semiconductor package having an EMI shielding layer | Anna M. Prakash, Reynaldo A. Olmedo, Venmathy McMahan, Rajendra C. Dias, Ann Jinyan Xu +2 more | 2018-06-05 |
| 9953909 | Ball grid array (BGA) with anchoring pins | Zuyang Liang, Michael Garcia, Srikant Nekkanty | 2018-04-24 |
| 9953929 | Systems and methods for electromagnetic interference shielding | Rajendra C. Dias, Anna M. Prakash, Eric J. Li, Nachiket R. Raravikar | 2018-04-24 |
| 9847304 | Electronic device packages with conformal EMI shielding and related methods | Eric J. Li, Rajendra C. Dias, Mitul Modi | 2017-12-19 |
| 9824901 | Complex cavity formation in molded packaging structures | Sasha N. Oster, Adel A. Elsherbini, Shawna M. Liff | 2017-11-21 |
| 9795026 | Electronic package that includes finned vias | Nayandeep K. Mahanta, Adel A. Elsherbini | 2017-10-17 |
| 9780510 | Socket contact techniques and configurations | Dhanya Athreya, Gaurav Chawla, Kemal Aygun, Glen P. Gordon, Sarah M. Canny +3 more | 2017-10-03 |