Issued Patents All Time
Showing 51–75 of 107 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11282633 | Device with out-plane inductors | Fay Hua, Sidharth Dalmia | 2022-03-22 |
| 11276635 | Horizontal pitch translation using embedded bridge dies | Sujit Sharan, Kemal Aygun, Zhiguo Qian, Yidnekachew S. Mekonnen, Jianyong Xie | 2022-03-15 |
| 11230817 | Rainfall induction type two-component high-polymer grouting device and manufacturing method thereof | Changguang Qi, Jinjing Pan, Kan Liu, Longzhen Ye, You Gao | 2022-01-25 |
| 11212932 | Pin count socket having reduced pin count and pattern transformation | Srikant Nekkanty, Kemal Aygun | 2021-12-28 |
| 11121468 | Antenna modules and communication devices | Sidharth Dalmia, Trang Thai, William J. Lambert, Jiwei Sun | 2021-09-14 |
| 11107757 | Integrated circuit structures in package substrates | Sanka Ganesan, William J. Lambert, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael J. Hill +1 more | 2021-08-31 |
| 11095045 | Slow wave structure for millimeter wave antennas | Jiwei Sun, Kemal Aygun | 2021-08-17 |
| 11089689 | Fine feature formation techniques for printed circuit boards | Eric J. Li, Kemal Aygun, Kai Xiao, Gong Ouyang | 2021-08-10 |
| 10797394 | Antenna modules and communication devices | Sidharth Dalmia, Trang Thai, William J. Lambert, Jiwei Sun | 2020-10-06 |
| 10784428 | LED filament and LED light bulb | Tao Jiang, YUKIHIRO SAITO, HAYATO UNAGIIKE | 2020-09-22 |
| 10716231 | Pin count socket having reduced pin count and pattern transformation | Srikant Nekkanty, Kemal Aygun | 2020-07-14 |
| 10672693 | Integrated circuit structures in package substrates | Sanka Ganesan, William J. Lambert, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael J. Hill +1 more | 2020-06-02 |
| 10658765 | Edge-firing antenna walls built into substrate | Sri Chaitra Jyotsna Chavali, Sanka Ganesan, William J. Lambert, Debendra Mallik | 2020-05-19 |
| 10651525 | Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Yidnekachew S. Mekonnen, Aleksandar Aleksov +3 more | 2020-05-12 |
| 10620526 | Mask, manufacturing method thereof, patterning method employing mask, optical filter | Tsung Chieh Kuo, Zheng Liu, Shoukun Wang | 2020-04-14 |
| 10617000 | Printed circuit board (PCB) with three-dimensional interconnects to other printed circuit boards | Daqiao Du, Zhen Zhou, Jun Liao, James A. McCall, Xiang Li +1 more | 2020-04-07 |
| D879958 | Medical balloon Group | Fanqi Li, Suoyuan Ji | 2020-03-31 |
| 10580806 | Method of manufacturing a display substrate, method of manufacturing a display device and display substrate | Xiaoxiang Zhang, Huibin Guo, Mingxuan Liu | 2020-03-03 |
| 10431912 | CPU socket contact for improving bandwidth throughput | Gregorio R. Murtagian | 2019-10-01 |
| 10433421 | Reduced capacitance land pad | Tao Wu, Gaurav Chawla, Jeffrey Lee | 2019-10-01 |
| 10416378 | Chip-to-chip interconnect with embedded electro-optical bridge structures | Kemal Aygun, Robert L. Sankman | 2019-09-17 |
| 10317932 | Capacitive structures for crosstalk reduction | Xiang Li, Kemal Aygun, Zhiguo Qian, Tolga Memioglu | 2019-06-11 |
| 10303225 | Methods of forming hybrid socket structures for package interconnect applications and structures formed thereby | Kemal Aygun, Cemil Geyik, Guneet Kaur | 2019-05-28 |
| 10241361 | Color film substrate, manufacturing method thereof and display device | Tsungchieh Kuo, Zheng Liu, Mingxuan Liu, Shoukun Wang, Jingjing Jiang | 2019-03-26 |
| 10209573 | UV curing mask plate and a fabricating method thereof and a display device | Xiaoxiang Zhang, Zheng Liu, Zongjie Guo, Mingxuan Liu, Xi Chen | 2019-02-19 |