Issued Patents All Time
Showing 76–100 of 107 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10209584 | Manufacturing method of metal layer, functional substrate and manufacturing method thereof, and display device | Xiaoxiang Zhang, Liping Luo, Mingxuan Liu, Huibin Guo | 2019-02-19 |
| 10103054 | Coupled vias for channel cross-talk reduction | Zhiguo Qian, Tolga Memioglu, Kemal Aygun | 2018-10-16 |
| 10088518 | Apparatus and method for classifying and locating electrical faults in circuitry | Mayue Xie, Zhiguo Qian, Jong-Ru Guo, Zuoguo Wu | 2018-10-02 |
| 9992859 | Low loss and low cross talk transmission lines using shaped vias | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Yidnekachew S. Mekonnen, Aleksandar Aleksov +3 more | 2018-06-05 |
| 9971089 | Chip-to-chip interconnect with embedded electro-optical bridge structures | Kemal Aygun, Robert L. Sankman | 2018-05-15 |
| 9922751 | Helically insulated twinax cable systems and methods | Gong Ouyang, Kai Xiao, Eric J. Li, Kemal Aygun | 2018-03-20 |
| 9899225 | Method for manufacturing array substrate, array substrate and mask | Tsung Chieh Kuo, Zheng Liu, Xiaoxiang Zhang, Xi Chen, Mingxuan Liu | 2018-02-20 |
| 9899430 | GOA unit and method for producing the same, gate driver circuit | Xiaoxiang Zhang, Tsung Chieh Kuo, Zheng Liu, Mingxuan Liu, Xi Chen | 2018-02-20 |
| 9894752 | Inductors for circuit board through hole structures | Gong Ouyang, Kai Xiao, Kemal Aygun, Beom-Taek Lee | 2018-02-13 |
| 9832876 | CPU package substrates with removable memory mechanical interfaces | Mani N. Prakash, Thomas T. Holden, Jeffory L. Smalley, Ram Viswanath, Bassam N. Coury +11 more | 2017-11-28 |
| 9807866 | Shielding mold for electric and magnetic EMI mitigation | Adel A. Elsherbini, Robert L. Sankman, Kemal Aygun | 2017-10-31 |
| 9806011 | Non-uniform substrate stackup | Tao Wu, Zhiguo Qian, Kemal Aygun | 2017-10-31 |
| 9775224 | Discharge apparatus and display panel preparation system based thereon | Zongjie Guo, Zheng Liu, Xiangqian Ding, Mingxuan Liu | 2017-09-26 |
| 9761617 | Method for manufacturing array substrate, array substrate and display device | Zheng Liu, Tsung Chieh Kuo, Xi Chen, Xiaoxiang Zhang, Mingxuan Liu | 2017-09-12 |
| 9710089 | Touch display panel having a plurality of spacers connected to a thin film transistor and manufacturing method thereof | Xi Chen, Jinchao Bai, Zheng Liu, Xiaoxiang Zhang, Mingxuan Liu | 2017-07-18 |
| 9570386 | Flexible package-to-socket interposer | Donald T. Tran | 2017-02-14 |
| 9564407 | Crosstalk polarity reversal and cancellation through substrate material | Tolga Memioglu, Tao Wu, Kemal Aygun | 2017-02-07 |
| 9548734 | Smart impedance matching for high-speed I/O | Hongjiang Song, Yan Song, Zhiguo Qian | 2017-01-17 |
| 9491881 | Microelectronic socket comprising a substrate and an insulative insert mated with openings in the substrate | Joshua D. Heppner, Srikant Nekkanty, Michael Garcia | 2016-11-08 |
| 9478881 | Snap connector for socket assembly and associated techniques and configurations | Gaurav Chawla, Rajasekaran Swaminathan, Kemal Aygun, Li Sun | 2016-10-25 |
| 9391018 | Crosstalk polarity reversal and cancellation through substrate material tuning | Tolga Memioglu, Tao Wu, Kemal Aygun | 2016-07-12 |
| 9385457 | Connector assembly and method | Gaurav Chawla, Joshua D. Heppner, David J. Llapitan, Vijaykumar Krithivasan | 2016-07-05 |
| 9232639 | Non-uniform substrate stackup | Tao Wu, Zhiguo Qian, Kemal Aygun | 2016-01-05 |
| 9076698 | Flexible package-to-socket interposer | Donald T. Tran | 2015-07-07 |
| 9069910 | Mechanism for facilitating dynamic cancellation of signal crosstalk in differential input/output channels | Khine Han, Kemal Aygun | 2015-06-30 |