Issued Patents All Time
Showing 101–114 of 114 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7119545 | Capacitive monitors for detecting metal extrusion during electromigration | Ishtiaq Ahsan, Roy Iggulden, Edward W. Kiewra, Ping-Chuan Wang | 2006-10-10 |
| 7098054 | Method and structure for determining thermal cycle reliability | Jason P. Gill, Vincent J. McGahay, Paul S. McLaughlin, Conal E. Murray, Hazara S. Rathore +2 more | 2006-08-29 |
| 6989282 | Control of liner thickness for improving thermal cycle reliability | Lynne M. Gignac, Vincent J. McGahay, Conal E. Murray, Hazara S. Rathore, Thomas M. Shaw +1 more | 2006-01-24 |
| 6870263 | Device interconnection | Lawrence A. Clevenger, Mark Hoinkis, Jeffery L. Hurd, Roy Iggulden, Herbert Palm +5 more | 2005-03-22 |
| 6836106 | Apparatus and method for testing semiconductors | Kevin Brelsford, Kenneth P. Rodbell, Ping-Chuan Wang | 2004-12-28 |
| 6803662 | Low dielectric constant material reinforcement for improved electromigration reliability | Ping-Chuan Wang, Kevin Brelsford | 2004-10-12 |
| 6603321 | Method and apparatus for accelerated determination of electromigration characteristics of semiconductor wiring | Alvin W. Strong, Timothy D. Sullivan, Deborah Tibel, Michael Ruprecht, Carole D. Graas | 2003-08-05 |
| 6518670 | Electrically porous on-chip decoupling/shielding layer | Jack A. Mandelman, Jeffrey P. Gambino, Richard A. Wachnik | 2003-02-11 |
| 6448173 | Aluminum-based metallization exhibiting reduced electromigration and method therefor | Lawrence A. Clevenger, Kenneth P. Rodbell, Roy Iggulden, Chao-Kun Hu, Lynne M. Gignac +3 more | 2002-09-10 |
| 6417572 | Process for producing metal interconnections and product produced thereby | Dureseti Chidambarrao, Robert Rosenberg, Thomas M. Shaw, Timothy D. Sullivan, Richard A. Wachnik | 2002-07-09 |
| 6383920 | Process of enclosing via for improved reliability in dual damascene interconnects | Ping-Chuan Wang, Robert D. Edwards, Edward W. Kiewra, Roy Iggulden | 2002-05-07 |
| 6202191 | Electromigration resistant power distribution network | Phillip Lin, Thomas M. Shaw, Richard A. Wachnik | 2001-03-13 |
| 6037795 | Multiple device test layout | James J. Poulin, Robert D. Raviart, Kenneth P. Rodbell, Richard G. Smith, Timothy D. Sullivan +1 more | 2000-03-14 |
| 5943601 | Process for fabricating a metallization structure | Takamasa Usui, Patrick W. DeHaven, Kenneth P. Rodbell, Chi-Hua Yang, Tomio Katata +1 more | 1999-08-24 |