Issued Patents All Time
Showing 26–49 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10686126 | Back end of line metallization structures | Joseph F. Maniscalco, Cornelius Brown Peethala, Chih-Chao Yang | 2020-06-16 |
| 10685876 | Liner and cap structures for reducing local interconnect vertical resistance without compromising reliability | Su Chen Fan, Hemanth Jagannathan, Cornelius Brown Peethala | 2020-06-16 |
| 10672707 | Low aspect ratio interconnect | Benjamin D. Briggs, Elbert E. Huang, Cornelius Brown Peethala, David L. Rath, Chih-Chao Yang | 2020-06-02 |
| 10559530 | Forming dual metallization interconnect structures in single metallization level | Hari Prasad Amanapu, Charan V. Surisetty | 2020-02-11 |
| 10461248 | Bottom electrode for MRAM applications | Prasad Bhosale, Michael Rizzolo, Chih-Chao Yang | 2019-10-29 |
| 10373867 | Cobalt contact and interconnect structures | Hari Prasad Amanapu, Cornelius Brown Peethala, Chih-Chao Yang | 2019-08-06 |
| 10373909 | Selective surface modification of interconnect structures | Cornelius Brown Peethala, Roger A. Quon, Chih-Chao Yang | 2019-08-06 |
| 10242872 | Rework of patterned dielectric and metal hardmask films | John C. Arnold, Prasad Bhosale, Donald F. Canaperi, Cornelius Brown Peethala, Hosadurga Shobha +1 more | 2019-03-26 |
| 10211153 | Low aspect ratio interconnect | Benjamin D. Briggs, Elbert E. Huang, Cornelius Brown Peethala, David L. Rath, Chih-Chao Yang | 2019-02-19 |
| 10204829 | Low-resistivity metallic interconnect structures with self-forming diffusion barrier layers | Hari Prasad Amanapu, Cornelius Brown Peethala, Chih-Chao Yang, Takeshi Nogami | 2019-02-12 |
| 10177030 | Cobalt contact and interconnect structures | Hari Prasad Amanapu, Cornelius Brown Peethala, Chih-Chao Yang | 2019-01-08 |
| 10096769 | Bottom electrode for MRAM applications | Prasad Bhosale, Michael Rizzolo, Chih-Chao Yang | 2018-10-09 |
| 10002831 | Selective and non-selective barrier layer wet removal | Benjamin D. Briggs, Elbert E. Huang, Cornelius Brown Peethala, David L. Rath, Hosadurga Shobha | 2018-06-19 |
| 9934980 | Rework and stripping of complex patterning layers using chemical mechanical polishing | Jassem A. Abdallah, Brown C. Peethala | 2018-04-03 |
| 9881833 | Barrier planarization for interconnect metallization | Benjamin D. Briggs, Elbert E. Huang, Takeshi Nogami, Cornelius Brown Peethala, David L. Rath | 2018-01-30 |
| 9859218 | Selective surface modification of interconnect structures | Cornelius Brown Peethala, Roger A. Quon, Chih-Chao Yang | 2018-01-02 |
| 9837350 | Semiconductor interconnect structure with double conductors | Benjamin D. Briggs, Takeshi Nogami | 2017-12-05 |
| 9806023 | Selective and non-selective barrier layer wet removal | Benjamin D. Briggs, Elbert E. Huang, Cornelius Brown Peethala, David L. Rath, Hosadurga Shobha | 2017-10-31 |
| 9685406 | Selective and non-selective barrier layer wet removal | Benjamin D. Briggs, Elbert E. Huang, Cornelius Brown Peethala, David L. Rath, Hosadurga Shobha | 2017-06-20 |
| 9666529 | Method and structure to reduce the electric field in semiconductor wiring interconnects | Elbert E. Huang, Takeshi Nogami, Christopher J. Penny, Theodorus E. Standaert | 2017-05-30 |
| 9640514 | Wafer bonding using boron and nitrogen based bonding stack | Wei Lin, Troy L. Graves-Abe, Donald F. Canaperi, Spyridon Skordas, Matthew T. Shoudy +2 more | 2017-05-02 |
| 9379057 | Method and structure to reduce the electric field in semiconductor wiring interconnects | Elbert E. Huang, Takeshi Nogami, Christopher J. Penny, Theodorus E. Standaert | 2016-06-28 |
| 9275874 | Methods for fabricating integrated circuits using chemical mechanical planarization to recess metal | Kunaljeet Tanwar, Xunyuan Zhang, Donald F. Canaperi | 2016-03-01 |
| 9190285 | Rework and stripping of complex patterning layers using chemical mechanical polishing | Jassem A. Abdallah, Brown C. Peethala | 2015-11-17 |