Issued Patents All Time
Showing 426–450 of 635 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9418935 | Integrated circuit line ends formed using additive processing | Dongbing Shao, Lei Zhuang, Lars Liebmann | 2016-08-16 |
| 9418934 | Structure and fabrication method for electromigration immortal nanoscale interconnects | Benjamin D. Briggs, Koichi Motoyama, Michael Rizzolo | 2016-08-16 |
| 9412654 | Graphene sacrificial deposition layer on beol copper liner-seed for mitigating queue-time issues between liner and plating step | Junjing Bao, Vincent J. McGahay, Joyeeta Nag, Richard S. Wise, Yiheng Xu | 2016-08-09 |
| 9406888 | Carbon nanotube device | Chandrasekhar Narayan, Gregory A. Northrop, Carl Radens, Brian C. Sapp | 2016-08-02 |
| 9391020 | Interconnect structure having large self-aligned vias | John H. Zhang, Carl Radens, Yiheng Xu, Richard S. Wise, Akil Khamisi Sutton +2 more | 2016-07-12 |
| 9385062 | Integrated circuit barrierless microfluidic channel | Vincent J. McGahay, Joyeeta Nag, Yiheng Xu | 2016-07-05 |
| 9385177 | Technique for fabrication of microelectronic capacitors and resistors | John H. Zhang, Carl Radens, Yiheng Xu, Edem Wornyo | 2016-07-05 |
| 9373561 | Integrated circuit barrierless microfluidic channel | Vincent J. McGahay, Joyeeta Nag, Yiheng Xu | 2016-06-21 |
| 9362230 | Methods to form conductive thin film structures | Vincent J. McGahay, Joyeeta Nag, Yiheng Xu | 2016-06-07 |
| 9337087 | Multilayer structure in an integrated circuit for damage prevention and detection and methods of creating the same | John H. Zhang, Carl Radens, Yiheng Xu, Byoung Youp Kim, Walter Kleemeier | 2016-05-10 |
| 9324793 | Method for controlling the profile of an etched metallic layer | Carl Radens, Richard S. Wise, Edem Wornyo, Yiheng Xu, John H. Zhang | 2016-04-26 |
| 9281278 | Interconnects with improved TDDB | Jing Hui Li, Wu Ping Liu | 2016-03-08 |
| 9252201 | Method of forming back-end-of-line planar resistor | Roger A. Booth, Jr. | 2016-02-02 |
| 9240375 | Modular fuses and antifuses for integrated circuits | John H. Zhang, Carl Radens, Yiheng Xu, Edem Wornyo | 2016-01-19 |
| 9214429 | Trench interconnect having reduced fringe capacitance | John H. Zhang, Hsueh-Chung Chen, Yann Mignot, Carl Radens, Richard S. Wise +2 more | 2015-12-15 |
| 9209036 | Method for controlling the profile of an etched metallic layer | Carl Radens, Richard S. Wise, Edem Wornyo, Yiheng Xu, John H. Zhang | 2015-12-08 |
| 9171800 | Electrical fuse with bottom contacts | Zhengwen Li, Dan Moy, Viraj Y. Sardesai, Keith H. Tabakman | 2015-10-27 |
| 9089080 | Corrugated interfaces for multilayered interconnects | Timothy J. Dalton, Elbert E. Huang, Sampath Purushothaman, Carl Radens | 2015-07-21 |
| 9082625 | Patterning through imprinting | Carl Radens, Richard S. Wise, Yiheng Xu, John H. Zhang | 2015-07-14 |
| 9030295 | RFID tag with environmental sensor | Ira L. Allen, Kevin S. Petrarca, Carl Radens | 2015-05-12 |
| 9018092 | Encapsulated metal interconnect | John H. Zhang, Carl Radens, Yiheng Xu | 2015-04-28 |
| 8970004 | Electrostatic discharge devices for integrated circuits | John H. Zhang, Carl Radens, Yiheng Xu | 2015-03-03 |
| 8952539 | Methods for fabrication of an air gap-containing interconnect structure | Maxime Darnon, Satyanarayana V. Nitta, Anthony D. Lisi, Qinghuang Lin | 2015-02-10 |
| 8921976 | Using backside passive elements for multilevel 3D wafers alignment applications | John H. Zhang, Yiheng Xu | 2014-12-30 |
| 8900990 | System and method of combining damascenes and subtract metal etch for advanced back end of line interconnections | John H. Zhang, Carl Radens, Yiheng Xu, Walter Kleemeier, Cindy Goldberg | 2014-12-02 |