Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205621 | Device and method for alignment of vertically stacked wafers and die | John H. Zhang, Paul Ferreira, Ronald K. Sampson | 2021-12-21 |
| 10615125 | Device and method for alignment of vertically stacked wafers and die | John H. Zhang, Paul Ferreira, Ronald K. Sampson | 2020-04-07 |
| 9870999 | Device and method for alignment of vertically stacked wafers and die | John H. Zhang, Paul Ferreira, Ronald K. Sampson | 2018-01-16 |
| 9646939 | Multilayer structure in an integrated circuit for damage prevention and detection and methods of creating the same | John H. Zhang, Lawrence A. Clevenger, Carl Radens, Yiheng Xu, Byoung Youp Kim | 2017-05-09 |
| 9633909 | Process for integrated circuit fabrication including a liner silicide with low contact resistance | Qing Liu | 2017-04-25 |
| 9543397 | Backside source-drain contact for integrated circuit transistor devices and method of making same | John H. Zhang | 2017-01-10 |
| 9337087 | Multilayer structure in an integrated circuit for damage prevention and detection and methods of creating the same | John H. Zhang, Lawrence A. Clevenger, Carl Radens, Yiheng Xu, Byoung Youp Kim | 2016-05-10 |
| 9324660 | Device and method for alignment of vertically stacked wafers and die | John H. Zhang, Paul Ferreira, Ronald K. Sampson | 2016-04-26 |
| 9240454 | Integrated circuit including a liner silicide with low contact resistance | Qing Liu | 2016-01-19 |
| 9209305 | Backside source-drain contact for integrated circuit transistor devices and method of making same | John H. Zhang | 2015-12-08 |
| 8987780 | Graphene capped HEMT device | John H. Zhang, Cindy Goldberg | 2015-03-24 |
| 8900990 | System and method of combining damascenes and subtract metal etch for advanced back end of line interconnections | John H. Zhang, Lawrence A. Clevenger, Carl Radens, Yiheng Xu, Cindy Goldberg | 2014-12-02 |
| 8569899 | Device and method for alignment of vertically stacked wafers and die | John H. Zhang, Paul Ferreira, Ronald K. Sampson | 2013-10-29 |
| 8560111 | Method of determining pressure to apply to wafers during a CMP | John H. Zhang, Ronald K. Sampson | 2013-10-15 |
| 8476765 | Copper interconnect structure having a graphene cap | John H. Zhang, Cindy Goldberg, Ronald K. Sampson | 2013-07-02 |