Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205621 | Device and method for alignment of vertically stacked wafers and die | John H. Zhang, Walter Kleemeier, Paul Ferreira | 2021-12-21 |
| 10615125 | Device and method for alignment of vertically stacked wafers and die | John H. Zhang, Walter Kleemeier, Paul Ferreira | 2020-04-07 |
| 10199392 | FinFET device having a partially dielectric isolated fin structure | Nicolas Loubet | 2019-02-05 |
| 9870999 | Device and method for alignment of vertically stacked wafers and die | John H. Zhang, Walter Kleemeier, Paul Ferreira | 2018-01-16 |
| 9601381 | Method for the formation of a finFET device with epitaxially grown source-drain regions having a reduced leakage path | Nicolas Loubet, Stephane Monfray | 2017-03-21 |
| 9601382 | Method for the formation of a FinFET device with epitaxially grown source-drain regions having a reduced leakage path | Stephane Monfray, Nicolas Loubet | 2017-03-21 |
| 9385051 | Method for the formation of a FinFET device having partially dielectric isolated fin structure | Nicolas Loubet | 2016-07-05 |
| 9324660 | Device and method for alignment of vertically stacked wafers and die | John H. Zhang, Walter Kleemeier, Paul Ferreira | 2016-04-26 |
| 9136384 | Method for the formation of a FinFET device having partially dielectric isolated Fin structure | Nicolas Loubet | 2015-09-15 |
| 8569899 | Device and method for alignment of vertically stacked wafers and die | John H. Zhang, Walter Kleemeier, Paul Ferreira | 2013-10-29 |
| 8560111 | Method of determining pressure to apply to wafers during a CMP | John H. Zhang, Walter Kleemeier | 2013-10-15 |
| 8476765 | Copper interconnect structure having a graphene cap | John H. Zhang, Cindy Goldberg, Walter Kleemeier | 2013-07-02 |
| 6424137 | Use of acoustic spectral analysis for monitoring/control of CMP processes | — | 2002-07-23 |
| 6087709 | Method of forming an integrated circuit having spacer after shallow trench fill and integrated circuit formed thereby | Todd H. Gandy, Robert Louis Hodges | 2000-07-11 |
| 6022788 | Method of forming an integrated circuit having spacer after shallow trench fill and integrated circuit formed thereby | Todd H. Gandy, Robert Louis Hodges | 2000-02-08 |
| 5313044 | Method and apparatus for real-time wafer temperature and thin film growth measurement and control in a lamp-heated rapid thermal processor | Hisham Z. Massoud | 1994-05-17 |