Issued Patents All Time
Showing 76–100 of 111 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101172 | Dielectric damage-free dual damascene Cu interconnects without barrier at via bottom | Benjamin D. Briggs, Gangadhara Raja Muthinti, Cornelius Brown Peethala, Lawrence A. Clevenger | 2021-08-24 |
| 11094580 | Structure and method to fabricate fully aligned via with reduced contact resistance | Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2021-08-17 |
| 11081388 | Forming barrierless contact | Kisik Choi, Ashim Dutta, Iqbal Rashid Saraf, Benjamin D. Briggs | 2021-08-03 |
| 11069566 | Hybrid sidewall barrier facilitating low resistance interconnection | Oscar van der Straten, Joseph F. Maniscalco, Scott A. DeVries | 2021-07-20 |
| 11062943 | Top via interconnects with wrap around liner | Nicholas Anthony Lanzillo, Christopher J. Penny, Somnath Ghosh, Robert R. Robison, Lawrence A. Clevenger | 2021-07-13 |
| 11024577 | Embedded anti-fuses for small scale applications | Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2021-06-01 |
| 10957646 | Hybrid BEOL metallization utilizing selective reflection mask | Benjamin D. Briggs, Cornelius Brown Peethala, Michael Rizzolo, Gen Tsutsui, Ruqiang Bao +2 more | 2021-03-23 |
| 10950493 | Interconnects having air gap spacers | Kenneth Chun Kuen Cheng, Oscar van der Straten, Joseph F. Maniscalco, Chih-Chao Yang | 2021-03-16 |
| 10903116 | Void-free metallic interconnect structures with self-formed diffusion barrier layers | Joseph F. Maniscalco, James J. Kelly, Hosadurga Shobha, Chih-Chao Yang | 2021-01-26 |
| 10886168 | Surface modified dielectric refill structure | Chih-Chao Yang, Terry A. Spooner, Shyng-Tsong Chen | 2021-01-05 |
| 10840325 | Low resistance metal-insulator-metal capacitor electrode | Joseph F. Maniscalco, Oscar van der Straten, Chih-Chao Yang | 2020-11-17 |
| 10748812 | Air-gap containing metal interconnects | Kenneth Chun Kuen Cheng, Kisik Choi, Chih-Chao Yang | 2020-08-18 |
| 10658233 | Dielectric damage-free dual damascene Cu interconnects without barrier at via bottom | Benjamin D. Briggs, Gangadhara Raja Muthinti, Cornelius Brown Peethala, Lawrence A. Clevenger | 2020-05-19 |
| 10586767 | Hybrid BEOL metallization utilizing selective reflection mask | Benjamin D. Briggs, Cornelius Brown Peethala, Michael Rizzolo, Gen Tsutsui, Ruqiang Bao +2 more | 2020-03-10 |
| 10546815 | Low resistance interconnect structure with partial seed enhancement liner | Oscar van der Straten, Joseph F. Maniscalco, Alexander Reznicek | 2020-01-28 |
| 10529622 | Void-free metallic interconnect structures with self-formed diffusion barrier layers | Joseph F. Maniscalco, James J. Kelly, Hosadurga Shobha, Chih-Chao Yang | 2020-01-07 |
| 10388600 | Binary metallization structure for nanoscale dual damascene interconnects | Alexander Reznicek, Oscar van der Straten, Praneet Adusumilli | 2019-08-20 |
| 10361119 | Enlarged contact area structure using noble metal cap and noble metal liner | Chih-Chao Yang, James J. Kelly, Cornelius Brown Peethala | 2019-07-23 |
| 10340355 | Method of forming a dual metal interconnect structure | Praneet Adusumilli, Hemanth Jagannathan, Oscar van der Straten | 2019-07-02 |
| 10269698 | Binary metallization structure for nanoscale dual damascene interconnects | Alexander Reznicek, Oscar van der Straten, Praneet Adusumilli | 2019-04-23 |
| 10217664 | Reflow interconnect using Ru | Lawrence A. Clevenger, Su Chen Fan, Huai Huang, Wei Wang, Chih-Chao Yang | 2019-02-26 |
| 10211101 | Reflow interconnect using Ru | Lawrence A. Clevenger, Su Chen Fan, Huai Huang, Wei Wang, Chih-Chao Yang | 2019-02-19 |
| 10204828 | Enabling low resistance gates and contacts integrated with bilayer dielectrics | Ruqiang Bao, Benjamin D. Briggs, Lawrence A. Clevenger, Cornelius Brown Peethala, Michael Rizzolo +1 more | 2019-02-12 |
| 10134674 | Structure and method for improved stabilization of cobalt cap and/or cobalt liner in interconnects | Benjamin D. Briggs, James J. Kelly, Roger A. Quon, Michael Rizzolo, Theodorus E. Standaert | 2018-11-20 |
| 9966305 | Ion flow barrier structure for interconnect metallization | James J. Demarest, James J. Kelly, Christopher J. Penny, Oscar van der Straten | 2018-05-08 |