Issued Patents All Time
Showing 51–75 of 111 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11244859 | Interconnects having a via-to-line spacer for preventing short circuit events between a conductive via and an adjacent line | Cornelius Brown Peethala, Christopher J. Penny, Nicholas Anthony Lanzillo, Lawrence A. Clevenger | 2022-02-08 |
| 11244897 | Back end of line metallization | Chanro Park, Kenneth Chun Kuen Cheng, Somnath Ghosh, Chih-Chao Yang | 2022-02-08 |
| 11244860 | Double patterning interconnect integration scheme with SAV | Shyng-Tsong Chen, Terry A. Spooner, Chih-Chao Yang | 2022-02-08 |
| 11244854 | Dual damascene fully aligned via in interconnects | Kenneth Chun Kuen Cheng, Chanro Park, Chih-Chao Yang | 2022-02-08 |
| 11244853 | Fully aligned via interconnects with partially removed etch stop layer | Kenneth Chun Kuen Cheng, Chanro Park, Chih-Chao Yang | 2022-02-08 |
| 11239278 | Bottom conductive structure with a limited top contact area | Chih-Chao Yang, Baozhen Li, Theodorus E. Standaert | 2022-02-01 |
| 11239414 | Physical unclonable function for MRAM structures | Ruilong Xie, Alexander Reznicek, Oscar van der Straten | 2022-02-01 |
| 11227792 | Interconnect structures including self aligned vias | Chih-Chao Yang, Terry A. Spooner, Shyng-Tsong Chen | 2022-01-18 |
| 11217481 | Fully aligned top vias | Nicholas Anthony Lanzillo, Somnath Ghosh, Christopher J. Penny, Robert R. Robison, Lawrence A. Clevenger | 2022-01-04 |
| 11205591 | Top via interconnect with self-aligned barrier layer | Kenneth Chun Kuen Cheng, Chanro Park, Chih-Chao Yang | 2021-12-21 |
| 11201112 | Fully-aligned skip-vias | Kenneth Chun Kuen Cheng, Chanro Park, Chih-Chao Yang | 2021-12-14 |
| 11201056 | Pitch multiplication with high pattern fidelity | Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2021-12-14 |
| 11183455 | Interconnects with enlarged contact area | Oscar van der Straten, Kenneth Chun Kuen Cheng, Joseph F. Maniscalco | 2021-11-23 |
| 11177162 | Trapezoidal interconnect at tight BEOL pitch | Nicholas Anthony Lanzillo, Hosadurga Shobha, Huai Huang, Junli Wang, Christopher J. Penny +1 more | 2021-11-16 |
| 11177163 | Top via structure with enlarged contact area with upper metallization level | Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2021-11-16 |
| 11177169 | Interconnects with gouged vias | Kenneth Chun Kuen Cheng, Chih-Chao Yang, Hosadurga Shobha | 2021-11-16 |
| 11177170 | Removal of barrier and liner layers from a bottom of a via | Chanro Park, Kenneth Chun Kuen Cheng, Nicholas Anthony Lanzillo | 2021-11-16 |
| 11177171 | Encapsulated top via interconnects | Oscar van der Straten, Kenneth Chun Kuen Cheng, Joseph F. Maniscalco | 2021-11-16 |
| 11177214 | Interconnects with hybrid metal conductors | Kenneth Chun Kuen Cheng, Chanro Park, Chih-Chao Yang | 2021-11-16 |
| 11164774 | Interconnects with spacer structure for forming air-gaps | Kenneth Chun Kuen Cheng, Chanro Park, Chih-Chao Yang | 2021-11-02 |
| 11164815 | Bottom barrier free interconnects without voids | Kenneth Chun Kuen Cheng, Kisik Choi, Cornelius Brown Peethala, Hosadurga Shobha, Joe Lee | 2021-11-02 |
| 11158538 | Interconnect structures with cobalt-infused ruthenium liner and a cobalt cap | Joseph F. Maniscalco, Oscar van der Straten, Scott A. DeVries, Alexander Reznicek | 2021-10-26 |
| 11139201 | Top via with hybrid metallization | Nicholas Anthony Lanzillo, Christopher J. Penny, Somnath Ghosh, Robert R. Robison, Lawrence A. Clevenger | 2021-10-05 |
| 11139202 | Fully aligned top vias with replacement metal lines | Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2021-10-05 |
| 11127676 | Removal or reduction of chamfer for fully-aligned via | Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2021-09-21 |