Issued Patents All Time
Showing 26–50 of 111 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027416 | BEOL etch stop layer without capacitance penalty | Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2024-07-02 |
| 12002498 | Coaxial top MRAM electrode | Oscar van der Straten, Chih-Chao Yang | 2024-06-04 |
| 11972977 | Fabrication of rigid close-pitch interconnects | Chanro Park, Kenneth Chun Kuen Cheng, Kisik Choi | 2024-04-30 |
| 11923246 | Via CD controllable top via structure | Dominik Metzler, Ekmini Anuja De Silva, Chanro Park, Hsueh-Chung Chen | 2024-03-05 |
| 11908732 | Alternating spacers for pitch structure | Hsueh-Chung Chen, Chanro Park | 2024-02-20 |
| 11887641 | Simultaneous electrodes for magneto-resistive random access memory devices | Oscar van der Straten, Chih-Chao Yang | 2024-01-30 |
| 11881431 | Anti-fuse with laterally extended liner | Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2024-01-23 |
| 11854884 | Fully aligned top vias | Nicholas Anthony Lanzillo, Somnath Ghosh, Christopher J. Penny, Robert R. Robison, Lawrence A. Clevenger | 2023-12-26 |
| 11848264 | Semiconductor structure with stacked vias having dome-shaped tips | Kenneth Chun Kuen Cheng, Chanro Park, Alexander Reznicek | 2023-12-19 |
| 11798842 | Line formation with cut-first tip definition | Chanro Park, Hsueh-Chung Chen, Yann Mignot | 2023-10-24 |
| 11791290 | Physical unclonable function for secure integrated hardware systems | Oscar van der Straten, Ruilong Xie, Alexander Reznicek | 2023-10-17 |
| 11758819 | Magneto-resistive random access memory with laterally-recessed free layer | Oscar van der Straten, Kenneth Chun Kuen Cheng, Joseph F. Maniscalco, Chih-Chao Yang | 2023-09-12 |
| 11735475 | Removal of barrier and liner layers from a bottom of a via | Chanro Park, Kenneth Chun Kuen Cheng, Nicholas Anthony Lanzillo | 2023-08-22 |
| 11735468 | Interconnect structures including self aligned vias | Chih-Chao Yang, Terry A. Spooner, Shyng-Tsong Chen | 2023-08-22 |
| 11682471 | Dual damascene crossbar array for disabling a defective resistive switching device in the array | Joseph F. Maniscalco, Oscar van der Straten, Choonghyun Lee, Seyoung Kim | 2023-06-20 |
| 11664271 | Dual damascene with short liner | Oscar van der Straten, Joseph F. Maniscalco, Alexander Reznicek, Raghuveer R. Patlolla, Theodorus E. Standaert | 2023-05-30 |
| 11637036 | Planarization stop region for use with low pattern density interconnects | Cornelius Brown Peethala, Hari Prasad Amanapu, Raghuveer R. Patlolla, Chih-Chao Yang | 2023-04-25 |
| 11430690 | Interconnects having air gap spacers | Kenneth Chun Kuen Cheng, Oscar van der Straten, Joseph F. Maniscalco, Chih-Chao Yang | 2022-08-30 |
| 11410879 | Subtractive back-end-of-line vias | Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2022-08-09 |
| 11380641 | Pillar bump with noble metal seed layer for advanced heterogeneous integration | Joseph F. Maniscalco, Kenneth Chun Kuen Cheng, Oscar van der Straten, Alexander Reznicek | 2022-07-05 |
| 11315872 | Self-aligned top via | Chanro Park, Kenneth Chun Kuen Cheng, Kisik Choi, Chih-Chao Yang | 2022-04-26 |
| 11289375 | Fully aligned interconnects with selective area deposition | Chanro Park, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2022-03-29 |
| 11282768 | Fully-aligned top-via structures with top-via trim | Kenneth Chun Kuen Cheng, Brent A. Anderson, Joseph F. Maniscalco | 2022-03-22 |
| 11276636 | Adjustable via dimension and chamfer angle | Lawrence A. Clevenger, Gangadhara Raja Muthinti, Cornelius Brown Peethala, Benjamin D. Briggs, Michael Rizzolo | 2022-03-15 |
| 11270913 | BEOL metallization formation | Chanro Park, Kenneth Chun Kuen Cheng, Brent A. Anderson, Somnath Ghosh | 2022-03-08 |