Issued Patents All Time
Showing 51–75 of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7780801 | Flux composition and process for use thereof | Eric Duchesne, Valerie Oberson | 2010-08-24 |
| 7777323 | Semiconductor structure and method for forming the same | Yong-Chai Kwon, Keum-Hee Ma, Dong-Ho Lee, Seong-Il Han | 2010-08-17 |
| 7771541 | Method of removing metallic, inorganic and organic contaminants from chip passivation layer surfaces | Claude Blais, Eric Duchesne, Sylvain Ouimet, Gerald J. Scilla | 2010-08-10 |
| 7740713 | Flux composition and techniques for use thereof | Eric Duchesne, Michael A. Gaynes, Timothy A. Gosselin, Valerie Oberson | 2010-06-22 |
| 7666690 | System, apparatus and method of selective laser repair for metal bumps of semiconductor device stack | Se-Young Jeong | 2010-02-23 |
| 7588964 | Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the same | Yong-Chai Kwon, Dong-Ho Lee, Myung-Kee Chung, Sun-Won Kang, Keum-Hee Ma | 2009-09-15 |
| 7553751 | Method of forming solder bump with reduced surface defects | Se-Young Jeong, Jin Choi, Nam-Seog Kim | 2009-06-30 |
| 7537959 | Chip stack package and manufacturing method thereof | Gu-Sung Kim, Dong-Hyeon Jang, Seung-Duk Baek, Jae-Sik Chung | 2009-05-26 |
| 7534656 | Image sensor device and method of manufacturing the same | Yong-Chai Kwon, Gu-Sung Kim, Seong-Il Han, Keum-Hee Ma, Suk-Chae Kang +1 more | 2009-05-19 |
| 7524763 | Fabrication method of wafer level chip scale packages | Soon-Bum Kim, Ung-Kwang Kim, Keum-Hee Ma, Young-Hee Song, Sung-Min Sim +2 more | 2009-04-28 |
| 7521657 | Assembly having wafer with image sensor chips, a photo-sensitive adhesive pattern and plate thereof and method of manufacturing the same | Yong-Chai Kwon, Gu-Sung Kim, Keum-Hee Ma, Seong-Il Han | 2009-04-21 |
| 7459774 | Stacked chip package using photosensitive polymer and manufacturing method thereof | Yong-Chai Kwon, Keum-Hee Ma, Seong-II Han | 2008-12-02 |
| 7371614 | Image sensor device and methods thereof | Yong-Chai Kwon, Suk-Chae Kang, Gu-Sung Kim, Jong Woo Kim, Seong-Il Han +3 more | 2008-05-13 |
| 7307340 | Wafer-level electronic modules with integral connector contacts | Seung-Duk Baek, Dong-Hyeon Jang, Gu-Sung Kim, Jae-Sik Chung | 2007-12-11 |
| 7276799 | Chip stack package and manufacturing method thereof | Gu-Sung Kim, Dong-Hyeon Jang, Seung-Duk Baek, Jae-Sik Chung | 2007-10-02 |
| 7262475 | Image sensor device and method of manufacturing same | Yong-Chai Kwon, Gu-Sung Kim, Seong-Il Han, Keum-Hee Ma, Suk-Chae Kang +1 more | 2007-08-28 |
| 7215033 | Wafer level stack structure for system-in-package and method thereof | Se-Yong Oh, Young-Hee Song, Gu-Sung Kim | 2007-05-08 |
| 7151009 | Method for manufacturing wafer level chip stack package | Soon-Bum Kim, Ung-Kwang Kim, Se-Young Jeong, Young-Hee Song, Sung-Min Sim | 2006-12-19 |
| 7144074 | Mounting structure for bumper rail of front end module carrier for vehicle | — | 2006-12-05 |
| 7132358 | Method of forming solder bump with reduced surface defects | Se-Young Jeong, Jin Choi, Nam-Seog Kim | 2006-11-07 |
| 7118122 | Invisible passenger airbag door | — | 2006-10-10 |
| 7119425 | Stacked multi-chip semiconductor package improving connection reliability of stacked chips | Se-Young Jeong | 2006-10-10 |
| 6933586 | Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogens | Ann R. Fornof, Jeffrey Hedrick, Christy S. Tyberg | 2005-08-23 |
| 6890599 | Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displays | Stephen L. Buchwalter, Gareth G. Hougham, John J. Ritsko, Mary E. Rothwell, Peter M. Fryer | 2005-05-10 |
| 6854778 | Upper tray mounting structure | — | 2005-02-15 |