Issued Patents All Time
Showing 76–90 of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6844257 | Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogens | Ann R. Fornof, Jeffrey Hedrick, Christy S. Tyberg | 2005-01-18 |
| 6784485 | Diffusion barrier layer and semiconductor device containing same | Stephan A. Cohen, Timothy J. Dalton, John A. Fitzsimmons, Stephen M. Gates, Lynne M. Gignac +5 more | 2004-08-31 |
| 6783862 | Toughness, adhesion and smooth metal lines of porous low k dielectric interconnect structures | Jeffrey Hedrick, Kelly Malone, Christy S. Tyberg | 2004-08-31 |
| 6632536 | Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displays | Stephen L. Buchwalter, Gareth G. Hougham, John J. Ritsko, Mary E. Rothwell, Peter M. Fryer | 2003-10-14 |
| 6455443 | Method of fabricating low-dielectric constant interlevel dielectric films for BEOL interconnects with enhanced adhesion and low-defect density | Andrew Robert Eckert, John C. Hay, Jr., Jeffrey Hedrick, Eric G. Liniger, Eva E. Simonyi | 2002-09-24 |
| 5786041 | Alignment film, a method for producing the alignment film and a liquid crystal display device using the alignment film | Atsushi Takenaka, Kenichi Tajima, Hideo Takano, Shui-Chih Lien | 1998-07-28 |
| 5756146 | Inspecting copper or molybdenum lines on a substrate | Alfred Viehbeck | 1998-05-26 |
| 5660921 | Poly (aryl ether benzimidazoles) their use capping layers in microelectronic structures | Kie Y. Ahn, James L. Hedrick, Jeffrey W. Labadie, Robert J. Twieg, Alfred Viehbeck +1 more | 1997-08-26 |
| 5599582 | Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier | Eleftherios Adamopoulos, Jungihl Kim, Tae S. Oh, Terrence R. O'Toole, Sampath Purushothaman +4 more | 1997-02-04 |
| 5593720 | Process for making a multileveled electronic package | Kie Y. Ahn, James L. Hedrick, Jeffrey W. Labadie, Robert J. Twieg, Alfred Viehbeck +1 more | 1997-01-14 |
| 5582858 | Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier | Eleftherios Adamopoulos, Jungihl Kim, Tae S. Oh, Terrence R. O'Toole, Sampath Purushothaman +4 more | 1996-12-10 |
| 5569739 | Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier | Eleftherios Adamopoulos, Terrence R. O'Toole, Sampath Purushothaman, Jane M. Shaw, Alfred Viehbeck +1 more | 1996-10-29 |
| 5516874 | Poly(aryl ether benzimidazoles) | Kie Y. Ahn, James L. Hedrick, Jeffrey W. Labadie, Robert J. Twieg, Alfred Viehbeck +1 more | 1996-05-14 |
| 5326643 | Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier | Eleftherios Adamopoulos, Jungihl Kim, Tae S. Oh, Terrence R. O'Toole, Sampath Purushothaman +4 more | 1994-07-05 |
| 5151304 | Structure and method for enhancing adhesion to a polyimide surface | — | 1992-09-29 |