Issued Patents All Time
Showing 26–50 of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754921 | Stacked semiconductor apparatus, system and method of fabrication | Ki-Tae Park, Young-Don Choi, Yun-Sang Lee | 2017-09-05 |
| 9741562 | Method for forming polysilicon film | Seung Woo Shin, Woo Duck JUNG, Sung Kil CHO, Ho Min CHOI, Wan Suk Oh +4 more | 2017-08-22 |
| 9579738 | Flux composition and techniques for use thereof | Jae-Woong Nah, Nathalie Normand, Valerie Oberson | 2017-02-28 |
| 9393633 | Method of joining a chip on a substrate | Pascal Blais, Paul F. Fortier, Jae-Woong Nah, Soojae Park, Robert L. Toutant +1 more | 2016-07-19 |
| 9219035 | Integrated circuit chips having vertically extended through-substrate vias therein | Ho-Jin Lee, Myeong-Soon Park, Ju-Il Choi, Son-Kwan Hwang | 2015-12-22 |
| 9181947 | Compressor | Jin-Ung Shin, Geun-Hyung Lee, Seoung-Min Kang | 2015-11-10 |
| RE45781 | Toughness, adhesion and smooth metal lines of porous low K dielectric interconnect structures | Jeffrey Hedrick, Kelly Malone, Christy S. Tyberg | 2015-10-27 |
| 9039390 | Compressor | Jang-woo Lee, Bum-Dong Sa, Jin-Ung Shin | 2015-05-26 |
| 9041218 | Semiconductor device having through electrode and method of fabricating the same | Ki-Tae Park, Hyun-Kyoung Kim | 2015-05-26 |
| 9030004 | Stacked semiconductor apparatus, system and method of fabrication | Ki-Tae Park, Young-Don Choi, Yun-Sang Lee | 2015-05-12 |
| 8858205 | Compressor having an inlet port formed to overlap with a roller and a cylinder-type rotor for compressing a refrigerant | Bum-Dong Sa | 2014-10-14 |
| 8814546 | Compressor | Bum-Dong Sa, Se-Seok Seol, Seoung-Min Kang, Jin-Ung Shin | 2014-08-26 |
| 8659163 | Semiconductor device having through electrode and method of fabricating the same | Ki-Tae Park, Hyun-Kyoung Kim | 2014-02-25 |
| 8629059 | Methods of forming integrated circuit chips having vertically extended through-substrate vias therein | Ho-Jin Lee, Myeong-Soon Park, Ju-Il Choi, Son-Kwan Hwang | 2014-01-14 |
| 8444774 | Flux composition and process for use thereof | Eric Duschesne, Valerie Oberson | 2013-05-21 |
| 8368231 | Chipstack package and manufacturing method thereof | Gu-Sung Kim, Dong-Hyeon Jang, Seung-Duk Baek, Jae-Sik Chung | 2013-02-05 |
| 8288278 | Semiconductor device having through electrode and method of fabricating the same | Ki-Tae Park, Hyun-Kyoung Kim | 2012-10-16 |
| 8278766 | Wafer level stack structure for system-in-package and method thereof | Se-Yong Oh, Young-Hee Song, Gu-Sung Kim | 2012-10-02 |
| 8069685 | Capacity modulation compressor and air conditioning system having the same | Hyuk Nam, Seung-Hyoung Ha, Geun-Hyoung Lee | 2011-12-06 |
| 8004848 | Stack module, card including the stack module, and system including the stack module | Seung-Duk Baek, Mitsuo Umemoto | 2011-08-23 |
| 7977156 | Chipstack package and manufacturing method thereof | Gu-Sung Kim, Dong-Hyeon Jang, Seung-Duk Baek, Jae-Sik Chung | 2011-07-12 |
| 7938976 | Method of removing graphitic and/or fluorinated organic layers from the surface of a chip passivation layer having Si-containing compounds | — | 2011-05-10 |
| 7875552 | Methods of forming integrated circuit chips having vertically extended through-substrate vias therein and chips formed thereby | Ho-Jin Lee, Myeong-Soon Park, Ju-Il Choi, Son-Kwan Hwang | 2011-01-25 |
| 7824959 | Wafer level stack structure for system-in-package and method thereof | Se-Yong Oh, Young-Hee Song, Gu-Sung Kim | 2010-11-02 |
| 7786594 | Wafer level stack structure for system-in-package and method thereof | Se-Yong Oh, Young-Hee Song, Gu-Sung Kim | 2010-08-31 |