Issued Patents All Time
Showing 26–50 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811310 | Metal spacer self aligned double patterning with airgap integration | Hsueh-Chung Chen, Yann Mignot, Cornelius Brown Peethala, Lawrence A. Clevenger | 2020-10-20 |
| 10714389 | Structure and method using metal spacer for insertion of variable wide line implantation in SADP/SAQP integration | Hsueh-Chung Chen, Yann Mignot, Cornelius Brown Peethala, Lawrence A. Clevenger | 2020-07-14 |
| 10665512 | Stress modulation of nFET and pFET fin structures | Huimei Zhou, Kangguo Cheng, Michael P. Belyansky, Oleg Gluschenkov, Richard A. Conti +1 more | 2020-05-26 |
| 10651125 | Replacement metal cap by an exchange reaction | Cornelius Brown Peethala | 2020-05-12 |
| 10615027 | Stack viabar structures | Su Chen Fan, Hsueh-Chung Chen, Yann Mignot, Terence B. Hook | 2020-04-07 |
| 10529622 | Void-free metallic interconnect structures with self-formed diffusion barrier layers | Joseph F. Maniscalco, Koichi Motoyama, Hosadurga Shobha, Chih-Chao Yang | 2020-01-07 |
| 10520056 | Impact absorbing apparatus | — | 2019-12-31 |
| 10395986 | Fully aligned via employing selective metal deposition | Benjamin D. Briggs, Donald F. Canaperi, Michael Rizzolo, Lawrence A. Clevenger | 2019-08-27 |
| 10361119 | Enlarged contact area structure using noble metal cap and noble metal liner | Koichi Motoyama, Chih-Chao Yang, Cornelius Brown Peethala | 2019-07-23 |
| 10276434 | Structure and method using metal spacer for insertion of variable wide line implantation in SADP/SAQP integration | Hsueh-Chung Chen, Yann Mignot, Cornelius Brown Peethala, Lawrence A. Clevenger | 2019-04-30 |
| 10134674 | Structure and method for improved stabilization of cobalt cap and/or cobalt liner in interconnects | Benjamin D. Briggs, Koichi Motoyama, Roger A. Quon, Michael Rizzolo, Theodorus E. Standaert | 2018-11-20 |
| 10128151 | Devices and methods of cobalt fill metallization | Vimal Kamineni, Praneet Adusumilli, Oscar van der Straten, Balasubramanian Pranatharthiharan | 2018-11-13 |
| 9966305 | Ion flow barrier structure for interconnect metallization | James J. Demarest, Koichi Motoyama, Christopher J. Penny, Oscar van der Straten | 2018-05-08 |
| 9793213 | Ion flow barrier structure for interconnect metallization | James J. Demarest, Koichi Motoyama, Christopher J. Penny, Oscar van der Straten | 2017-10-17 |
| 9780035 | Structure and method for improved stabilization of cobalt cap and/or cobalt liner in interconnects | Benjamin D. Briggs, Koichi Motoyama, Roger A. Quon, Michael Rizzolo, Theodorus E. Standaert | 2017-10-03 |
| 9716065 | Via bottom structure and methods of forming | Takeshi Nogami | 2017-07-25 |
| 9466563 | Interconnect structure for an integrated circuit and method of fabricating an interconnect structure | Yann Mignot, Terry A. Spooner | 2016-10-11 |
| 9318347 | Wafer backside particle mitigation | Marc A. Bergendahl, James J. Demarest, Alex Richard Hubbard, Richard C. Johnson, Ryan O. Jung +3 more | 2016-04-19 |
| 9184042 | Wafer backside particle mitigation | Marc A. Bergendahl, James J. Demarest, Alex Richard Hubbard, Richard C. Johnson, Ryan O. Jung +3 more | 2015-11-10 |
| 8853095 | Hybrid hard mask for damascene and dual damascene | Tuan A. Vo | 2014-10-07 |
| 8698318 | Superfilled metal contact vias for semiconductor devices | Veeraraghavan S. Basker, Balasubramanian S. Pranatharthi Haran, Soon-Cheon Seo, Tuan A. Vo | 2014-04-15 |
| 8691687 | Superfilled metal contact vias for semiconductor devices | Veeraghavan S. Basker, Bala Haran, Soon-Cheon Seo, Tuan A. Vo | 2014-04-08 |
| 8435887 | Copper interconnect formation | Takeshi Nogami, Kazumichi Tsumura | 2013-05-07 |
| 7501345 | Selective silicide formation by electrodeposit displacement reaction | Veeraraghaven S. Basker, Hariklia Deligianni, Balasubramanian S. Pranatharthi Haran, Christian Lavoie, George G. Totir | 2009-03-10 |
| 7091832 | Acoustic detection of machinery malfunction | Jay A. Butterman | 2006-08-15 |