Issued Patents All Time
Showing 126–150 of 160 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8749293 | Stackable programmable passive device and a testing method | Fen Chen, Douglas D. Coolbaugh | 2014-06-10 |
| 8726201 | Method and system to predict a number of electromigration critical elements | Jeanne P. Bickford, Peter A. Habitz, Paul S. McLaughlin, Dileep N. Netrabile | 2014-05-13 |
| 8659156 | Interconnect structure with an electromigration and stress migration enhancement liner | Chih-Chao Yang | 2014-02-25 |
| 8656325 | Integrated circuit design method and system | John E. Barwin, Amol A. Joshi, Michael R. Ouellette | 2014-02-18 |
| 8642460 | Semiconductor switching device and method of making the same | Chih-Chao Yang, Stephen A. Cohen | 2014-02-04 |
| 8609504 | 3D via capacitor with a floating conductive plate for improved reliability | Chih-Chao Yang, Fen Chen | 2013-12-17 |
| 8421186 | Electrically programmable metal fuse | Chunyan E. Tian, Chih-Chao Yang | 2013-04-16 |
| 8405135 | 3D via capacitor with a floating conductive plate for improved reliability | Chih-Chao Yang, Fen Chen | 2013-03-26 |
| 8294505 | Stackable programmable passive device and a testing method | Fen Chen, Douglas D. Coolbaugh | 2012-10-23 |
| 8232809 | Determining critical current density for interconnect | Chad M. Burke, Cathryn J. Christiansen | 2012-07-31 |
| 8114768 | Electromigration resistant via-to-line interconnect | Paul S. McLaughlin, Timothy D. Sullivan | 2012-02-14 |
| 7981771 | Structures and methods to enhance Cu interconnect electromigration (EM) performance | — | 2011-07-19 |
| 7981732 | Programming of laser fuse | Dinesh A. Badami, Tom C. Lee, Gerald Matusiewicz, William T. Motsiff, Christopher D. Muzzy +2 more | 2011-07-19 |
| 7955971 | Hybrid metallic wire and methods of fabricating same | Chih-Chao Yang, Kaushik Chanda, Daniel C. Edelstein | 2011-06-07 |
| 7830019 | Via bottom contact and method of manufacturing same | Kaushik Chanda, Lawrence A. Clevenger, Andrew P. Cowley, Jason P. Gill, Chih-Chao Yang | 2010-11-09 |
| 7745324 | Interconnect with recessed dielectric adjacent a noble metal cap | Chih-Chao Yang, Shyng-Tsong Chen | 2010-06-29 |
| 7692439 | Structure for modeling stress-induced degradation of conductive interconnects | Kaushik Chanda, Birendra Agarwala, Lawrence A. Clevenger, Andrew P. Cowley, Ronald G. Filippi +7 more | 2010-04-06 |
| 7649262 | Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing | Jonathan D. Chapple-Sokol, Terence B. Hook, Thomas L. McDevitt, Christopher A. Ponsolle, Bette B. Reuter +2 more | 2010-01-19 |
| 7639032 | Structure for monitoring stress-induced degradation of conductive interconnects | Kaushik Chanda, Birendra Agarwala, Lawrence A. Clevenger, Andrew P. Cowley, Ronald G. Filippi +7 more | 2009-12-29 |
| 7585764 | VIA bottom contact and method of manufacturing same | Kaushik Chanda, Lawrence A. Clevenger, Andrew P. Cowley, Jason P. Gill, Chih-Chao Yang | 2009-09-08 |
| 7572650 | Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing | Jonathan D. Chapple-Sokol, Terence B. Hook, Thomas L. McDevitt, Christopher A. Ponsolle, Bette B. Reuter +2 more | 2009-08-11 |
| 7500208 | Non-destructive evaluation of microstructure and interface roughness of electrically conducting lines in semiconductor integrated circuits in deep sub-micron regime | Fen Chen, Jeffrey P. Gambino, Jason P. Gill, Timothy D. Sullivan | 2009-03-03 |
| 7397260 | Structure and method for monitoring stress-induced degradation of conductive interconnects | Kaushik Chanda, Birendra Agarwala, Lawrence A. Clevenger, Andrew P. Cowley, Ronald G. Filippi +7 more | 2008-07-08 |
| 7384824 | Structure and programming of laser fuse | Dinesh A. Badami, Tom C. Lee, Gerald Matusiewicz, William T. Motsiff, Christopher D. Muzzy +2 more | 2008-06-10 |
| 7231617 | Determination of grain sizes of electrically conductive lines in semiconductor integrated circuits | Fen Chen, Jeffrey P. Gambino, Jason P. Gill, Timothy D. Sullivan | 2007-06-12 |