NI

Nitin K. Ingle

Applied Materials: 215 patents #6 of 7,310Top 1%
MI Micromaterials: 6 patents #5 of 34Top 15%
AU Asml Us: 1 patents #12 of 55Top 25%
📍 San Jose, CA: #45 of 32,062 inventorsTop 1%
🗺 California: #445 of 386,348 inventorsTop 1%
Overall (All Time): #2,613 of 4,157,543Top 1%
223
Patents All Time

Issued Patents All Time

Showing 201–223 of 223 patents

Patent #TitleCo-InventorsDate
8435902 Invertable pattern loading with dry etch Jing Tang, Dongqing Yang, Shankar Venkataraman 2013-05-07
8329587 Post-planarization densification Jingmei Liang, Shankar Venkataraman 2012-12-11
8318584 Oxide-rich liner layer for flowable CVD gapfill Dongqing Li, Jingmei Liang 2012-11-27
8304351 In-situ ozone cure for radical-component CVD Linlin Wang, Abhijit Basu Mallick, Shankar Venkataraman 2012-11-06
8211808 Silicon-selective dry etch for carbon-containing films Kedar Sapre, Jing Tang, Linlin Wang, Abhijit Basu Mallick 2012-07-03
8043933 Integration sequences with top surface profile modification Chien-Teh Kao, Xinliang Lu, Zhenbin Ge, Mei Chang, Hoiman Raymond Hung 2011-10-25
8012887 Precursor addition to silicon oxide CVD for improved low temperature gapfill Shankar Venkataraman, Hiroshi Hamana, Manuel A. Hernandez, Paul Edward Gee 2011-09-06
7939422 Methods of thin film process Jing Tang, Yi Zheng, Zheng Yuan, Zhenbin Ge, Xinliang Lu +4 more 2011-05-10
7935643 Stress management for tensile films Jingmei Liang, Anjana M. Patel, Shankar Venkataraman 2011-05-03
7825038 Chemical vapor deposition of high quality flow-like silicon dioxide using a silicon containing precursor and atomic oxygen Zheng Yuan, Paul Edward Gee, Kedar Sapre 2010-11-02
7674684 Deposition methods for releasing stress buildup Jing Tang, Zheng Yuan, Rossella Mininni 2010-03-09
7642171 Multi-step anneal of thin films for film densification and improved gap-fill Zheng Yuan, Vikash Banthia, Xinyun Xia, Hali Forstner, Rong Pan 2010-01-05
7528051 Method of inducing stresses in the channel region of a transistor Reza Arghavani, Zheng Yuan, Ellie Yieh, Shankar Venkataraman 2009-05-05
7459405 Method using TEOS ramp-up during TEOS/ozone CVD for improved gap-fill Xinyua Xia, Zheng Yuan 2008-12-02
7456116 Gap-fill depositions in the formation of silicon containing dielectric materials Shan Wong, Xinyun Xia, Vikash Banthia, Won Bae Bang, Yen-Kun Wang +1 more 2008-11-25
7431967 Limited thermal budget formation of PMD layers Zheng Yuan, Shankar Venkataraman, Cary Ching, Shang-Hsiao WONG, Kevin Mukai 2008-10-07
7335609 Gap-fill depositions introducing hydroxyl-containing precursors in the formation of silicon containing dielectric materials Shan Wong, Xinyun Xia, Vikash Banthia, Won Bae Bang, Yen-Kun Wang 2008-02-26
7208425 Method using TEOS ramp-up during TEOS/ozone CVD for improved gap-fill Xinyua Xia, Zheng Yuan 2007-04-24
7037859 Method using TEOS ramp-up during TEOS/ozone CVD for improved gap-fill Xinyua Xia, Zheng Yuan 2006-05-02
6905940 Method using TEOS ramp-up during TEOS/ozone CVD for improved gap-fill Xinyua Xia, Zheng Yuan 2005-06-14
6843882 Gas flow control in a wafer processing system having multiple chambers for performing same process Karthik Janakiraman, Victor Wang, Vikash Banthia, Teresa Winson 2005-01-18
6793733 Gas distribution showerhead Karthik Janakiraman, Zheng Yuan, Steven Gianoulakis 2004-09-21
6544345 Method and system for in-situ cleaning of semiconductor manufacturing equipment using combination chemistries Bruce E. Mayer, Robert H. Chatham, III, Zheng Yuan 2003-04-08