Issued Patents All Time
Showing 201–225 of 238 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5990017 | Plasma reactor with heated source of a polymer-hardening precursor material | Michael R. Rice, David W. Groechel, Gerald Yin, Jon Mohn, Craig A. Roderick +5 more | 1999-11-23 |
| 5925212 | Apparatus and method for attaining repeatable temperature versus time profiles for plasma heated interactive parts used in mass production plasma processing | Michael R. Rice, David W. Groechel, James P. Cruse | 1999-07-20 |
| 5916689 | Electrostatic chuck with an impregnated, porous layer that exhibits the Johnson-Rahbeck effect | Joshua Tsui, Douglas A. Buchberger, Jr. | 1999-06-29 |
| 5888414 | Plasma reactor and processes using RF inductive coupling and scavenger temperature control | Chan-Lon Yang, Jerry Wong, Jeffrey Marks, Peter Keswick, David W. Groechel | 1999-03-30 |
| 5874361 | Method of processing a wafer within a reaction chamber | Douglas A. Buchberger, Jr. | 1999-02-23 |
| 5871811 | Method for protecting against deposition on a selected region of a substrate | David N. Wang, John M. White, Kam S. Law, Cissy Leung, Salvador P. Umotoy +3 more | 1999-02-16 |
| 5849136 | High frequency semiconductor wafer processing apparatus and method | Donald M. Mintz, Hiroji Hanawa, Sasson Somekh, Dan Maydan | 1998-12-15 |
| 5800871 | Electrostatic chuck with polymeric impregnation and method of making | Joshua Chiu-Wing Tsui, Douglas A. Buchberger, Jr. | 1998-09-01 |
| 5792562 | Electrostatic chuck with polymeric impregnation and method of making | Joshua Chiu-Wing Tsui, Douglas A. Buchberger, Jr. | 1998-08-11 |
| 5772832 | Process for etching oxides in an electromagnetically coupled planar plasma apparatus | Jeffrey Marks | 1998-06-30 |
| 5762714 | Plasma guard for chamber equipped with electrostatic chuck | Jon Mohn, Joshua Chiu-Wing Tsui | 1998-06-09 |
| 5755886 | Apparatus for preventing deposition gases from contacting a selected region of a substrate during deposition processing | David N. Wang, John M. White, Kam S. Law, Cissy Leung, Salvador P. Umotoy +3 more | 1998-05-26 |
| 5707486 | Plasma reactor using UHF/VHF and RF triode source, and process | — | 1998-01-13 |
| 5684669 | Method for dechucking a workpiece from an electrostatic chuck | Douglas A. Buchberger, Jr. | 1997-11-04 |
| 5618382 | High-frequency semiconductor wafer processing apparatus and method | Donald M. Mintz, Hiroji Hanawa, Sasson Somekh, Dan Maydan | 1997-04-08 |
| 5583737 | Electrostatic chuck usable in high density plasma | John Trow, Joshua Chiu-Wing Tsui, Craig A. Roderick, Nicolas Bright, Jeffrey Marks +2 more | 1996-12-10 |
| 5574410 | Electronically tuned matching networks using adjustable inductance elements and resonant tank circuits | John Trow, Craig A. Roderick, Jay D. Pinson, II, Douglas A. Buchberger, Jr., Robert HARTLAGE +1 more | 1996-11-12 |
| 5572170 | Electronically tuned matching networks using adjustable inductance elements and resonant tank circuits | John Trow, Craig A. Roderick, Jay D. Pinson, II, Douglas A. Buchberger, Jr., Robert HARTLAGE +1 more | 1996-11-05 |
| 5556501 | Silicon scavenger in an inductively coupled RF plasma reactor | Craig A. Roderick, John Trow, Chan-Lon Yang, Jerry Wong, Jeffrey Marks +7 more | 1996-09-17 |
| 5539609 | Electrostatic chuck usable in high density plasma | John Trow, Joshua Chiu-Wing Tsui, Craig A. Roderick, Nicolas Bright, Jeffrey Marks +2 more | 1996-07-23 |
| 5423945 | Selectivity for etching an oxide over a nitride | Jeffrey Marks, Chan-Lon Yang, David W. Groechel, Peter Keswick | 1995-06-13 |
| 5392018 | Electronically tuned matching networks using adjustable inductance elements and resonant tank circuits | John Trow, Craig A. Roderick, Jay D. Pinson, II, Douglas A. Buchberger, Jr., Robert HARTLAGE +1 more | 1995-02-21 |
| 5362526 | Plasma-enhanced CVD process using TEOS for depositing silicon oxide | David N. Wang, John M. White, Kam S. Law, Cissy Leung, Salvador P. Umotoy +3 more | 1994-11-08 |
| 5354715 | Thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process | David N. Wang, John M. White, Kam S. Law, Cissy Leung, Salvador P. Umotoy +3 more | 1994-10-11 |
| 5350479 | Electrostatic chuck for high power plasma processing | John Trow, Joshua Chiu-Wing Tsui, Craig A. Roderick, Nicolas Bright, Jeffrey Marks +1 more | 1994-09-27 |