Issued Patents All Time
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8440019 | Lower liner with integrated flow equalizer and improved conductance | James D. Carducci, Andrew Nguyen, Michael Kutney | 2013-05-14 |
| 8398814 | Tunable gas flow equalizer | Jason A. Kenney, Andrew Nguyen, Kenneth S. Collins | 2013-03-19 |
| 8329593 | Method and apparatus for removing polymer from the wafer backside and edge | Imad Yousif, Anchel Sheyner, Nancy Fung, Ying Rui, Martin Jeffrey Salinas +2 more | 2012-12-11 |
| 8282736 | Lower liner with integrated flow equalizer and improved conductance | James D. Carducci, Andrew Nguyen, Michael Kutney | 2012-10-09 |
| 8118938 | Lower liner with integrated flow equalizer and improved conductance | James D. Carducci, Andrew Nguyen, Michael Kutney | 2012-02-21 |
| 8075728 | Gas flow equalizer plate suitable for use in a substrate process chamber | Shahid Rauf, Andrew Nguyen, Michael D. Willwerth, Valentin N. Todorow | 2011-12-13 |
| 7987814 | Lower liner with integrated flow equalizer and improved conductance | James D. Carducci, Andrew Nguyen, Michael Kutney | 2011-08-02 |
| 7967996 | Process for wafer backside polymer removal and wafer front side photoresist removal | Kenneth S. Collins, Hiroji Hanawa, Andrew Nguyen, Shahid Rauf, Valentin N. Todorow +6 more | 2011-06-28 |
| 7879183 | Apparatus and method for front side protection during backside cleaning | Imad Yousif, Ying Rui, Nancy Fung, Martin Jeffrey Salinas, Anchel Sheyner +2 more | 2011-02-01 |
| 7569463 | Method of thermal processing structures formed on a substrate | Paul G. Carey, Dean Jennings, Abhilash J. Mayur, Stephen Moffatt, William Schaffer +1 more | 2009-08-04 |
| 7552736 | Process for wafer backside polymer removal with a ring of plasma under the wafer | Kenneth S. Collins, Hiroji Hanawa, Andrew Nguyen, David Palagashvili, James P. Cruse +7 more | 2009-06-30 |
| 7041931 | Stepped reflector plate | Dean Jennings, Joseph M. Ranish, Brian Haas, Sundar Ramamurthy, Aaron Muir Hunter +1 more | 2006-05-09 |
| 6803546 | Thermally processing a substrate | Ryan Boas, Benjamin Bierman, Brian Haas, Dean Jennings, Wolfgang Aderhold +2 more | 2004-10-12 |
| 6215106 | Thermally processing a substrate | Ryan Boas, Benjamin Bierman, Brian Haas, Dean Jennings, Wolfgang Aderhold | 2001-04-10 |