Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6803546 | Thermally processing a substrate | Ryan Boas, Ajit Balakrishna, Brian Haas, Dean Jennings, Wolfgang Aderhold +2 more | 2004-10-12 |
| 6395363 | Sloped substrate support | David S. Ballance, Robert Haney, David W. LaCourt | 2002-05-28 |
| 6215106 | Thermally processing a substrate | Ryan Boas, Ajit Balakrishna, Brian Haas, Dean Jennings, Wolfgang Aderhold | 2001-04-10 |
| 6157106 | Magnetically-levitated rotor system for an RTP chamber | James V. Tietz | 2000-12-05 |
| 6133152 | Co-rotating edge ring extension for use in a semiconductor processing chamber | Meredith J. Williams, David S. Ballance, Brian Haas, Paul Deaton, James V. Tietz | 2000-10-17 |
| 6123766 | Method and apparatus for achieving temperature uniformity of a substrate | Meredith J. Williams, David S. Ballance, Paul Deaton, Brian Haas, Nobuyuki Takahashi +1 more | 2000-09-26 |
| 6090210 | Multi-zone gas flow control in a process chamber | David S. Ballance, James V. Tietz | 2000-07-18 |
| 6035100 | Reflector cover for a semiconductor processing chamber | David S. Ballance, James V. Tietz, Brian Haas, Meredith J. Williams, Paul Deaton | 2000-03-07 |
| 5960555 | Method and apparatus for purging the back side of a substrate during chemical vapor processing | Paul Deaton, Meredith J. Williams, Brian Haas, David S. Ballance, James V. Tietz | 1999-10-05 |
| 5920797 | Method for gaseous substrate support | David S. Ballance, James V. Tietz, Brian Haas | 1999-07-06 |
| 5884412 | Method and apparatus for purging the back side of a substrate during chemical vapor processing | James V. Tietz, David S. Ballance | 1999-03-23 |
| 5879128 | Lift pin and support pin apparatus for a processing chamber | James V. Tietz | 1999-03-09 |
| 5848889 | Semiconductor wafer support with graded thermal mass | James V. Tietz, David S. Ballance | 1998-12-15 |
| 5781693 | Gas introduction showerhead for an RTP chamber with upper and lower transparent plates and gas flow therebetween | David S. Ballance, James V. Tietz | 1998-07-14 |