| 6803546 |
Thermally processing a substrate |
Ryan Boas, Ajit Balakrishna, Brian Haas, Dean Jennings, Wolfgang Aderhold +2 more |
2004-10-12 |
| 6395363 |
Sloped substrate support |
David S. Ballance, Robert Haney, David W. LaCourt |
2002-05-28 |
| 6215106 |
Thermally processing a substrate |
Ryan Boas, Ajit Balakrishna, Brian Haas, Dean Jennings, Wolfgang Aderhold |
2001-04-10 |
| 6157106 |
Magnetically-levitated rotor system for an RTP chamber |
James V. Tietz |
2000-12-05 |
| 6133152 |
Co-rotating edge ring extension for use in a semiconductor processing chamber |
Meredith J. Williams, David S. Ballance, Brian Haas, Paul Deaton, James V. Tietz |
2000-10-17 |
| 6123766 |
Method and apparatus for achieving temperature uniformity of a substrate |
Meredith J. Williams, David S. Ballance, Paul Deaton, Brian Haas, Nobuyuki Takahashi +1 more |
2000-09-26 |
| 6090210 |
Multi-zone gas flow control in a process chamber |
David S. Ballance, James V. Tietz |
2000-07-18 |
| 6035100 |
Reflector cover for a semiconductor processing chamber |
David S. Ballance, James V. Tietz, Brian Haas, Meredith J. Williams, Paul Deaton |
2000-03-07 |
| 5960555 |
Method and apparatus for purging the back side of a substrate during chemical vapor processing |
Paul Deaton, Meredith J. Williams, Brian Haas, David S. Ballance, James V. Tietz |
1999-10-05 |
| 5920797 |
Method for gaseous substrate support |
David S. Ballance, James V. Tietz, Brian Haas |
1999-07-06 |
| 5884412 |
Method and apparatus for purging the back side of a substrate during chemical vapor processing |
James V. Tietz, David S. Ballance |
1999-03-23 |
| 5879128 |
Lift pin and support pin apparatus for a processing chamber |
James V. Tietz |
1999-03-09 |
| 5848889 |
Semiconductor wafer support with graded thermal mass |
James V. Tietz, David S. Ballance |
1998-12-15 |
| 5781693 |
Gas introduction showerhead for an RTP chamber with upper and lower transparent plates and gas flow therebetween |
David S. Ballance, James V. Tietz |
1998-07-14 |
