Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9201030 | Method and system for non-destructive distribution profiling of an element in a film | Paola deCecco, Bruno W. Schueler, David A. Reed, Michael Kwan | 2015-12-01 |
| 8916823 | Method and system for non-destructive distribution profiling of an element in a film | Paolo deCecco, Bruno W. Schueler, David A. Reed, Michael Kwan | 2014-12-23 |
| 8610059 | Method and system for non-destructive distribution profiling of an element in a film | Paola deCecco, Bruno W. Schueler, David A. Reed, Michael Kwan | 2013-12-17 |
| 8269167 | Method and system for non-destructive distribution profiling of an element in a film | Paola deCecco, Bruno W. Schueler, David A. Reed, Michael Kwan | 2012-09-18 |
| 7884321 | Method and system for non-destructive distribution profiling of an element in a film | Paola deCecco, Bruno W. Schueler, David A. Reed, Michael Kwan | 2011-02-08 |
| 6395363 | Sloped substrate support | Benjamin Bierman, Robert Haney, David W. LaCourt | 2002-05-28 |
| 6133152 | Co-rotating edge ring extension for use in a semiconductor processing chamber | Benjamin Bierman, Meredith J. Williams, Brian Haas, Paul Deaton, James V. Tietz | 2000-10-17 |
| 6123766 | Method and apparatus for achieving temperature uniformity of a substrate | Meredith J. Williams, Benjamin Bierman, Paul Deaton, Brian Haas, Nobuyuki Takahashi +1 more | 2000-09-26 |
| 6090210 | Multi-zone gas flow control in a process chamber | Benjamin Bierman, James V. Tietz | 2000-07-18 |
| 6035100 | Reflector cover for a semiconductor processing chamber | Benjamin Bierman, James V. Tietz, Brian Haas, Meredith J. Williams, Paul Deaton | 2000-03-07 |
| 5960555 | Method and apparatus for purging the back side of a substrate during chemical vapor processing | Paul Deaton, Benjamin Bierman, Meredith J. Williams, Brian Haas, James V. Tietz | 1999-10-05 |
| 5920797 | Method for gaseous substrate support | Benjamin Bierman, James V. Tietz, Brian Haas | 1999-07-06 |
| 5884412 | Method and apparatus for purging the back side of a substrate during chemical vapor processing | James V. Tietz, Benjamin Bierman | 1999-03-23 |
| 5848889 | Semiconductor wafer support with graded thermal mass | James V. Tietz, Benjamin Bierman | 1998-12-15 |
| 5820923 | Curing silica precursors by exposure to nitrous oxide | Loren A. Haluska, Mark Loboda | 1998-10-13 |
| 5781693 | Gas introduction showerhead for an RTP chamber with upper and lower transparent plates and gas flow therebetween | Benjamin Bierman, James V. Tietz | 1998-07-14 |
| 5523163 | Low dielectric constant coatings | Robert Charles Camilletti, Diana K. Dunn | 1996-06-04 |
| 5441765 | Method of forming Si-O containing coatings | Robert Charles Camilletti, Diana K. Dunn | 1995-08-15 |
| 5436029 | Curing silicon hydride containing materials by exposure to nitrous oxide | Marie N. Eckstein, Mark Loboda, Keith W. Michael, Liberty B. Shelton | 1995-07-25 |
| 5320868 | Method of forming SI-O containing coatings | Keith W. Michael | 1994-06-14 |
| 5310583 | Vapor phase deposition of hydrogen silsesquioxane resin in the presence of nitrous oxide | Marie N. Eckstein | 1994-05-10 |
| 5145723 | Process for coating a substrate with silica | Robert Charles Camilletti, Theresa E. Gentle | 1992-09-08 |