Issued Patents All Time
Showing 51–73 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6566283 | Silane treatment of low dielectric constant materials in semiconductor device manufacturing | Minh Van Ngo, Dawn Hopper, Lu You | 2003-05-20 |
| 6555461 | Method of forming low resistance barrier on low k interconnect | Christy Mei-Chu Woo, Minh Van Ngo | 2003-04-29 |
| 6518646 | Semiconductor device with variable composition low-k inter-layer dielectric and method of making | Dawn Hopper, Calvin T. Gabriel, Richard J. Huang, Lu You | 2003-02-11 |
| 6509267 | Method of forming low resistance barrier on low k interconnect with electrolessly plated copper seed layer | Christy Mei-Chu Woo, Connie P. Wang | 2003-01-21 |
| 6475929 | Method of manufacturing a semiconductor structure with treatment to sacrificial stop layer producing diffusion to an adjacent low-k dielectric layer lowering the constant | Calvin T. Gabriel, Lynne A. Okada, Fei Wang | 2002-11-05 |
| 6472336 | Forming an encapsulating layer after deposition of a dielectric comprised of corrosive material | Minh Van Ngo, Richard J. Huang | 2002-10-29 |
| 6468894 | Metal interconnection structure with dummy vias | Kai Yang | 2002-10-22 |
| 6462417 | Coherent alloy diffusion barrier for integrated circuit interconnects | Pin-Chin Connie Wang, Amit P. Marathe, Minh Van Ngo | 2002-10-08 |
| 6383950 | Insulating and capping structure with preservation of the low dielectric constant of the insulating layer | Minh Van Ngo, Susan Tovar | 2002-05-07 |
| 6380067 | Method for creating partially UV transparent anti-reflective coating for semiconductors | Ramkumar Subramanian, Minh Van Ngo, Kashmir Sahota, Christopher F. Lyons | 2002-04-30 |
| 6361837 | Method and system for modifying and densifying a porous film | Richard J. Huang, Shekhar Pramanick | 2002-03-26 |
| 6352930 | Bilayer anti-reflective coating and etch hard mask | Kathleen R. Early, Maria C. Chan, Lewis Shen | 2002-03-05 |
| 6326692 | Insulating and capping structure with preservation of the low dielectric constant of the insulating layer | Minh Van Ngo, Susan Tovar | 2001-12-04 |
| 6294460 | Semiconductor manufacturing method using a high extinction coefficient dielectric photomask | Ramkumar Subramanian, Minh Van Ngo, Kashmir Sahota | 2001-09-25 |
| 6291296 | Method for removing anti-reflective coating layer using plasma etch process before contact CMP | Angela T. Hui, Wenge Yang, Kashmir Sahota, Mark T. Ramsbey, Minh Van Ngo | 2001-09-18 |
| 6232002 | Bilayer anti-reflective coating and etch hard mask | Kathleen R. Early, Maria C. Chan, Lewis Shen | 2001-05-15 |
| 6221794 | Method of reducing incidence of stress-induced voiding in semiconductor interconnect lines | Paul R. Besser, Minh Van Ngo | 2001-04-24 |
| 6191030 | Anti-reflective coating layer for semiconductor device | Ramkumar Subramanian, John G. Pellerin, Ernesto A. Gallardo | 2001-02-20 |
| 6174743 | Method of reducing incidence of stress-induced voiding in semiconductor interconnect lines | Paul R. Besser, Minh Van Ngo | 2001-01-16 |
| 6171947 | Method of reducing incidence of stress-induced voiding in semiconductor interconnect lines | Paul R. Besser, Minh Van Ngo, Stephan K. Park, Susan Tovar | 2001-01-09 |
| 6143672 | Method of reducing metal voidings in 0.25 .mu.m AL interconnect | Minh Van Ngo, Simon S. Chan, Robert A. Huertas | 2000-11-07 |
| 6136649 | Method for removing anti-reflective coating layer using plasma etch process after contact CMP | Angela T. Hui, Wenge Yang, Kashmir Sahota, Mark T. Ramsbey, Minh Van Ngo | 2000-10-24 |
| 5986344 | Anti-reflective coating layer for semiconductor device | Ramkumar Subramanion, John G. Pellerin, Ernesto A. Gallardo | 1999-11-16 |