| 12180086 |
Method for improving conductivity and blue light filtering efficiency of transparent conducting oxide (TCO) |
Xuqiang Liu, Gang Liu, Nana Li |
2024-12-31 |
|
| 7566181 |
Controlling critical dimensions of structures formed on a wafer in semiconductor processing |
Alan Nolet |
2009-07-28 |
|
| 7217652 |
Method of forming highly conductive semiconductor structures via plasma etch |
— |
2007-05-15 |
$6,634,000 |
| 6878622 |
Method for forming SAC using a dielectric as a BARC and FICD enlarger |
Ramkumar Subramanian, Fei Wang, Lewis Shen |
2005-04-12 |
$6,806,000 |
| 6645824 |
Combined optical profilometry and projection microscopy of integrated circuit structures |
Junwei Bao, Xinhui Niu, Nickhil Jakatdar, Yasuhiro Okumoto |
2003-11-11 |
|
| 6627526 |
Method for fabricating a conductive structure for a semiconductor device |
Bhanwar Singh |
2003-09-30 |
$4,535,000 |
| 6596623 |
Use of organic spin on materials as a stop-layer for local interconnect, contact and via layers |
Ramkumar Subramanian |
2003-07-22 |
$3,195,000 |
| 6534411 |
Method of high density plasma metal etching |
Lewis Shen |
2003-03-18 |
$1,685,000 |
| 6515328 |
Semiconductor devices with reduced control gate dimensions |
Lewis Shen, Mark S. Chang |
2003-02-04 |
$1,030,000 |
| 6482699 |
Method for forming self-aligned contacts and local interconnects using decoupled local interconnect process |
YongZhong Hu, Fei Wang, Yu Sun, Ramkumar Subramanian |
2002-11-19 |
$1,532,000 |
| 6452225 |
Method and structure of etching a memory cell polysilicon gate layer using resist mask and etched silicon oxynitride |
Lewis Shen |
2002-09-17 |
|
| 6423612 |
Method of fabricating a shallow trench isolation structure with reduced topography |
John Jianshi Wang, Fei Wang |
2002-07-23 |
$1,368,000 |
| 6420240 |
Method for reducing the step height of shallow trench isolation structures |
John Jianshi Wang, Hao Fang |
2002-07-16 |
$1,835,000 |
| 6416933 |
Method to produce small space pattern using plasma polymerization layer |
Bhanwar Singh, Bharath Rangarajan |
2002-07-09 |
$2,516,000 |
| 6383939 |
Method for etching memory gate stack using thin resist layer |
Lewis Shen |
2002-05-07 |
$2,110,000 |
| 6376389 |
Method for eliminating anti-reflective coating in semiconductors |
Ramkumar Subramanian, Minh Van Ngo, Kashmir Sahota, YongZhong Hu, Hiroyuki Kinoshita +1 more |
2002-04-23 |
$2,653,000 |
| 6372651 |
Method for trimming a photoresist pattern line for memory gate etching |
Lewis Shen |
2002-04-16 |
$2,231,000 |
| 6365509 |
Semiconductor manufacturing method using a dielectric photomask |
Ramkumar Subramanian, Marina V. Plat, Lewis Shen |
2002-04-02 |
$3,760,000 |
| 6359307 |
Method for forming self-aligned contacts and interconnection lines using dual damascene techniques |
Fei Wang, Hiroyuki Kinoshita, Kashmir Sahota, Yu Sun |
2002-03-19 |
$4,163,000 |
| 6348406 |
Method for using a low dielectric constant layer as a semiconductor anti-reflective coating |
Ramkumar Subramanian, Minh Van Ngo, Kashmir Sahota, YongZhong Hu, Hiroyuki Kinoshita +1 more |
2002-02-19 |
$5,378,000 |
| 6306713 |
Method for forming self-aligned contacts and local interconnects for salicided gates using a secondary spacer |
YongZhong Hu, Fei Wang, Yu Sun, Hiroyuki Kinoshita |
2001-10-23 |
$2,669,000 |
| 6291296 |
Method for removing anti-reflective coating layer using plasma etch process before contact CMP |
Angela T. Hui, Kashmir Sahota, Mark T. Ramsbey, Suzette K. Pangrle, Minh Van Ngo |
2001-09-18 |
$2,710,000 |
| 6271154 |
Methods for treating a deep-UV resist mask prior to gate formation etch to improve gate profile |
Lewis Shen |
2001-08-07 |
$4,984,000 |
| 6218310 |
RTA methods for treating a deep-UV resist mask prior to gate formation etch to improve gate profile |
Lewis Shen |
2001-04-17 |
$5,863,000 |
| 6207575 |
Local interconnect etch characterization using AFM |
Bhanwar Sinjh |
2001-03-27 |
$5,495,000 |
