WY

Wenge Yang

AM AMD: 28 patents #342 of 9,279Top 4%
SL Spansion Llc.: 1 patents #435 of 769Top 60%
TT Timbre Technologies: 1 patents #24 of 39Top 65%
TL Tokyo Electron Limited: 1 patents #3,538 of 5,567Top 65%
Overall (All Time): #106,879 of 4,157,543Top 3%
33
Patents All Time

Issued Patents All Time

Showing 25 most recent of 33 patents

Patent #TitleCo-InventorsDate
12180086 Method for improving conductivity and blue light filtering efficiency of transparent conducting oxide (TCO) Xuqiang Liu, Gang Liu, Nana Li 2024-12-31
7566181 Controlling critical dimensions of structures formed on a wafer in semiconductor processing Alan Nolet 2009-07-28
7217652 Method of forming highly conductive semiconductor structures via plasma etch 2007-05-15
6878622 Method for forming SAC using a dielectric as a BARC and FICD enlarger Ramkumar Subramanian, Fei Wang, Lewis Shen 2005-04-12
6645824 Combined optical profilometry and projection microscopy of integrated circuit structures Junwei Bao, Xinhui Niu, Nickhil Jakatdar, Yasuhiro Okumoto 2003-11-11
6627526 Method for fabricating a conductive structure for a semiconductor device Bhanwar Singh 2003-09-30
6596623 Use of organic spin on materials as a stop-layer for local interconnect, contact and via layers Ramkumar Subramanian 2003-07-22
6534411 Method of high density plasma metal etching Lewis Shen 2003-03-18
6515328 Semiconductor devices with reduced control gate dimensions Lewis Shen, Mark S. Chang 2003-02-04
6482699 Method for forming self-aligned contacts and local interconnects using decoupled local interconnect process YongZhong Hu, Fei Wang, Yu Sun, Ramkumar Subramanian 2002-11-19
6452225 Method and structure of etching a memory cell polysilicon gate layer using resist mask and etched silicon oxynitride Lewis Shen 2002-09-17
6423612 Method of fabricating a shallow trench isolation structure with reduced topography John Jianshi Wang, Fei Wang 2002-07-23
6420240 Method for reducing the step height of shallow trench isolation structures John Jianshi Wang, Hao Fang 2002-07-16
6416933 Method to produce small space pattern using plasma polymerization layer Bhanwar Singh, Bharath Rangarajan 2002-07-09
6383939 Method for etching memory gate stack using thin resist layer Lewis Shen 2002-05-07
6376389 Method for eliminating anti-reflective coating in semiconductors Ramkumar Subramanian, Minh Van Ngo, Kashmir Sahota, YongZhong Hu, Hiroyuki Kinoshita +1 more 2002-04-23
6372651 Method for trimming a photoresist pattern line for memory gate etching Lewis Shen 2002-04-16
6365509 Semiconductor manufacturing method using a dielectric photomask Ramkumar Subramanian, Marina V. Plat, Lewis Shen 2002-04-02
6359307 Method for forming self-aligned contacts and interconnection lines using dual damascene techniques Fei Wang, Hiroyuki Kinoshita, Kashmir Sahota, Yu Sun 2002-03-19
6348406 Method for using a low dielectric constant layer as a semiconductor anti-reflective coating Ramkumar Subramanian, Minh Van Ngo, Kashmir Sahota, YongZhong Hu, Hiroyuki Kinoshita +1 more 2002-02-19
6306713 Method for forming self-aligned contacts and local interconnects for salicided gates using a secondary spacer YongZhong Hu, Fei Wang, Yu Sun, Hiroyuki Kinoshita 2001-10-23
6291296 Method for removing anti-reflective coating layer using plasma etch process before contact CMP Angela T. Hui, Kashmir Sahota, Mark T. Ramsbey, Suzette K. Pangrle, Minh Van Ngo 2001-09-18
6271154 Methods for treating a deep-UV resist mask prior to gate formation etch to improve gate profile Lewis Shen 2001-08-07
6218310 RTA methods for treating a deep-UV resist mask prior to gate formation etch to improve gate profile Lewis Shen 2001-04-17
6207575 Local interconnect etch characterization using AFM Bhanwar Sinjh 2001-03-27