Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10593562 | Method for creating through-connected vias and conductors on a substrate | Fred Koelling, Daniel Long | 2020-03-17 |
| 7566181 | Controlling critical dimensions of structures formed on a wafer in semiconductor processing | Wenge Yang | 2009-07-28 |
| 7515282 | Modeling and measuring structures with spatially varying properties in optical metrology | Shifang Li, Vi Vuong, Junwei Bao | 2009-04-07 |
| 7444196 | Optimized characterization of wafers structures for optical metrology | Steven Scheer, Manuel Madriaga | 2008-10-28 |