Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6383950 | Insulating and capping structure with preservation of the low dielectric constant of the insulating layer | Suzette K. Pangrle, Minh Van Ngo | 2002-05-07 |
| 6326692 | Insulating and capping structure with preservation of the low dielectric constant of the insulating layer | Suzette K. Pangrle, Minh Van Ngo | 2001-12-04 |
| 6171947 | Method of reducing incidence of stress-induced voiding in semiconductor interconnect lines | Suzette K. Pangrle, Paul R. Besser, Minh Van Ngo, Stephan K. Park | 2001-01-09 |