Issued Patents All Time
Showing 151–175 of 265 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8900949 | Staggered column superjunction | Lingpeng Guan, Madhur Bobde, Anup Bhalla | 2014-12-02 |
| 8884365 | Trench-gate field effect transistor | Daniel Calafut, Christopher Boguslaw Kocon, Steven Sapp, Dean E. Probst, Nathan Kraft +5 more | 2014-11-11 |
| 8865540 | Method for forming a schottky barrier diode integrated with a trench MOSFET | Daniel Calafut, Yi Su, Jongoh Kim, Hong Chang, Daniel Ng | 2014-10-21 |
| 8847306 | Direct contact in trench with three-mask shield gate process | Sung-Shan Tai, Anup Bhalla, Hong Chang, John Chen | 2014-09-30 |
| 8829640 | Configuration and method to generate saddle junction electric field in edge termination | Madhur Bobde, Lingpeng Guan, Anup Bhalla | 2014-09-09 |
| 8809948 | Device structure and methods of making high density MOSFETs for load switch and DC-DC applications | Madhur Bobde, Hong Chang, Yeeheng Lee, Daniel Calafut, Jongoh Kim +2 more | 2014-08-19 |
| 8802529 | Semiconductor device with field threshold MOSFET for high voltage termination | Madhur Bobde | 2014-08-12 |
| 8785278 | Nano MOSFET with trench bottom oxide shielded and third dimensional P-body contact | Daniel Ng, Daniel Calafut, Madhur Bobde, Anup Bhalla, Ji Pan +2 more | 2014-07-22 |
| 8785279 | High voltage field balance metal oxide field effect transistor (FBM) | Anup Bhalla, Madhur Bobde, Lingpeng Guan, Jun Hu, Jongoh Kim +1 more | 2014-07-22 |
| 8786010 | Superjunction structures for power devices and methods of manufacture | Joseph A. Yedinak, Christopher L. Rexer, Jaegil LEE, Chongman Yun | 2014-07-22 |
| 8779510 | Semiconductor power devices manufactured with self-aligned processes and more reliable electrical contacts | John Chen, Daniel Ng, Wenjun Li | 2014-07-15 |
| 8778735 | Packaging method of molded wafer level chip scale package (WLCSP) | Yan Xun Xue, Yueh-Se Ho, Jun Lu, Ping Huang, Lei Shi +2 more | 2014-07-15 |
| 8772868 | Superjunction structures for power devices and methods of manufacture | Joseph A. Yedinak, Mark L. Rinehimer, Praveen Muraleedharan Shenoy, James Pan, Rodney S. Ridley | 2014-07-08 |
| 8753935 | High frequency switching MOSFETs with low output capacitance using a depletable P-shield | Madhur Bobde, Sik Lui, Daniel Ng | 2014-06-17 |
| 8742401 | Field effect transistor with gated and non-gated trenches | Daniel Calafut, Steven Sapp, Nathan Kraft, Ashok Challa | 2014-06-03 |
| 8729601 | Nanotube semiconductor devices | Xiaobin Wang, Anup Bhalla, John Chen, Hong Chang | 2014-05-20 |
| 8710585 | High voltage fast recovery trench diode | Jun Hu, Karthik Padmanabhan, Madhur Bobde | 2014-04-29 |
| 8686546 | Combined packaged power semiconductor device | Yueh-Se Ho, Yan Xun Xue, Jun Lu | 2014-04-01 |
| 8680613 | Termination design for high voltage device | Lingpeng Guan, Anup Bhalla | 2014-03-25 |
| 8680611 | Field effect transistor and schottky diode structures | Christopher Boguslaw Kocon, Steven Sapp, Paul Thorup, Dean E. Probst, Robert Herrick +3 more | 2014-03-25 |
| 8669650 | Flip chip semiconductor device | Xiaotian Zhang, Jun Lu, Xiaoguang Zeng, Ming-Chen Lu | 2014-03-11 |
| 8664728 | Power transistor with protected channel | Yang Lu, Budong You, Marco A. Zuniga | 2014-03-04 |
| 8642385 | Wafer level package structure and the fabrication method thereof | Yan Xun Xue, Ping Huang, Yueh-Se Ho, Jun Lu, Ming-Chen Lu | 2014-02-04 |
| 8610235 | Trench MOSFET with integrated Schottky barrier diode | Daniel Calafut, Yi Su, Jongoh Kim, Hong Chang, Daniel Ng | 2013-12-17 |
| 8598623 | Nanotube semiconductor devices and nanotube termination structures | Xiaobin Wang, Anup Bhalla, John Chen, Hong Chang | 2013-12-03 |