Issued Patents All Time
Showing 126–150 of 265 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9184117 | Stacked dual-chip packaging structure and preparation method thereof | Yueh-Se Ho, Yan Xun Xue, Jun Lu | 2015-11-10 |
| 9171949 | Semiconductor device including superjunction structure formed using angled implant process | Karthik Padmanabhan, Madhur Bobde, Lingpeng Guan, Lei Zhang | 2015-10-27 |
| 9171788 | Semiconductor package with small gate clip and assembly method | Yan Xun Xue, Yueh-Se Ho, Jun Lu, Ming-Chen Lu, Hongtao Gao | 2015-10-27 |
| 9165866 | Stacked dual chip package having leveling projections | Xiaotian Zhang, Yan Xun Xue, Anup Bhalla, Jun Lu, Kai Liu +2 more | 2015-10-20 |
| 9147648 | Multi-die power semiconductor device packaged on a lead frame unit with multiple carrier pins and a metal clip | Yan Xun Xue | 2015-09-29 |
| 9136380 | Device structure and methods of making high density MOSFETs for load switch and DC-DC applications | Madhur Bobde, Hong Chang, Yeeheng Lee, Daniel Calafut, Jongoh Kim +2 more | 2015-09-15 |
| 9129822 | High voltage field balance metal oxide field effect transistor (FBM) | Anup Bhalla, Madhur Bobde, Lingpeng Guan, Jun Hu, Jongoh Kim +1 more | 2015-09-08 |
| 9105494 | Termination trench for power MOSFET applications | Yeeheng Lee, Madhur Bodbe, Daniel Calafut, Xiaobin Wang, Ji Pan +2 more | 2015-08-11 |
| 9087828 | Semiconductor device with thick bottom metal and preparation method thereof | Yan Xun Xue, Jun Lu, Ming-Chen Lu, Yan Huo, Aihua Lu | 2015-07-21 |
| 9082790 | Normally on high voltage switch | Madhur Bobde, Daniel Calafut, Karthik Padmanabhan | 2015-07-14 |
| 9064897 | Termination design for high voltage device | Lingpeng Guan, Anup Bhalla | 2015-06-23 |
| 9054091 | Hybrid packaged lead frame based multi-chip semiconductor device with multiple semiconductor chips and multiple interconnecting structures | Yan Xun Xue, Jun Lu, Peter H. Wilson, Yan Huo, Zhiqiang Niu +1 more | 2015-06-09 |
| 9048282 | Dual-gate trench IGBT with buried floating P-type shield | Jun Hu, Madhur Bobde | 2015-06-02 |
| 9041172 | Semiconductor device for restraining creep-age phenomenon and fabricating method thereof | Zhi Qiang Niu, Jun Lu, Fei Wang | 2015-05-26 |
| 9029236 | Termination structure with multiple embedded potential spreading capacitive for trench MOSFET and method | Xiaobin Wang, Anup Bhalla, Daniel Ng | 2015-05-12 |
| 9024375 | Nano-tube MOSFET technology and devices | Daniel Ng, Lingpeng Guan, Anup Bhalla, Wilson Ma, Moses Ho +1 more | 2015-05-05 |
| 9006901 | Thin power device and preparation method thereof | Yuping Gong, Yan Xun Xue, Ming-Chen Lu, Ping Huang, Jun Lu | 2015-04-14 |
| 9006870 | Stacked multi-chip packaging structure and manufacturing method thereof | Xiaotian Zhang, Hua Pan, Ming-Chen Lu, Jun Lu | 2015-04-14 |
| 8981539 | Packaged power semiconductor with interconnection of dies and metal clips on lead frame | Yan Xun Xue | 2015-03-17 |
| 8969953 | Method of forming a self-aligned charge balanced power DMOS | John Chen, Yeeheng Lee, Lingpeng Guan, Moses Ho, Wilson Ma +1 more | 2015-03-03 |
| 8951867 | High density trench-based power MOSFETs with self-aligned active contacts and method for making such devices | Yeeheng Lee, Hong Chang, Jongoh Kim, Sik Lui, Madhur Bobde +2 more | 2015-02-10 |
| 8952509 | Stacked multi-chip bottom source semiconductor device and preparation method thereof | Yueh-Se Ho, Yan Xun Xue, Jun Lu, Xiaotian Zhang, Zhi Qiang Niu +4 more | 2015-02-10 |
| 8946816 | High frequency switching MOSFETs with low output capacitance using a depletable P-shield | Madhur Bobde, Sik Lui, Daniel Ng | 2015-02-03 |
| 8928031 | Nanotube semiconductor devices | Xiaobin Wang, Anup Bhalla, John Chen, Hong Chang | 2015-01-06 |
| 8907414 | High voltage fast recovery trench diode | Jun Hu, Karthik Padmanabhan, Madhur Bobde | 2014-12-09 |