Issued Patents All Time
Showing 101–125 of 265 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9412684 | Top exposed semiconductor chip package | Yan Xun Xue, Yueh-Se Ho, Anup Bhalla, Jun Lu, Kai Liu | 2016-08-09 |
| 9397029 | Power semiconductor package device having locking mechanism, and preparation method thereof | Yan Xun Xue, Yueh-Se Ho, Jun Lu, De Mei Gong | 2016-07-19 |
| 9391005 | Method for packaging a power device with bottom source electrode | Yan Xun Xue, Yueh-Se Ho, Jun Lu, Lei Shi, Liang Zhao +1 more | 2016-07-12 |
| 9356022 | Semiconductor device with termination structure for power MOSFET applications | Yeeheng Lee, Madhur Bobde, Daniel Calafut, Xiaobin Wang, Ji Pan +2 more | 2016-05-31 |
| 9349796 | Nanotube semiconductor devices | Xiaobin Wang, Anup Bhalla, John Chen, Hong Chang | 2016-05-24 |
| 9337131 | Power semiconductor device and the preparation method | Yan Huo, Jun Lu, Ming-Chen Lu, Zhi Qiang Niu, Yan Xun Xue +1 more | 2016-05-10 |
| 9318587 | Injection control in semiconductor power devices | Madhur Bobde, Jun Hu, Lingpeng Guan, Lei Zhang, Jongoh Kim | 2016-04-19 |
| 9318424 | MCSP power semiconductor devices and preparation methods thereof | Zhiqiang Niu, Jun Lu, Hongtao Gao | 2016-04-19 |
| 9312381 | Lateral super-junction MOSFET device and termination structure | Madhur Bobde, Lingpeng Guan, Karthik Padmanabhan | 2016-04-12 |
| 9305870 | Power semiconductor device and preparation method thereof | Yan Xun Xue, Yueh-Se Ho, Jun Lu | 2016-04-05 |
| 9293397 | Power device and preparation method thereof | Yan Xun Xue, Jun Lu | 2016-03-22 |
| 9281416 | Trench MOSFET with integrated Schottky barrier diode | Daniel Calafut, Yi Su, Jongoh Kim, Hong Chang, Daniel Ng | 2016-03-08 |
| 9281394 | Nano MOSFET with trench bottom oxide shielded and third dimensional P-body contact | Daniel Ng, Daniel Calafut, Madhur Bobde, Anup Bhalla, Ji Pan +2 more | 2016-03-08 |
| 9281368 | Split-gate trench power MOSFET with protected shield oxide | Yeeheng Lee, Lingpeng Guan, Hongyong Xue, Yiming Gu, Yang Xiang +6 more | 2016-03-08 |
| 9252264 | High frequency switching MOSFETs with low output capacitance using a depletable P-shield | Madhur Bobde, Sik Lui, Daniel Ng | 2016-02-02 |
| 9252239 | Semiconductor power devices manufactured with self-aligned processes and more reliable electrical contacts | John Chen, Daniel Ng, Wenjun Li | 2016-02-02 |
| 9245949 | Nanotube semiconductor devices | Xiaobin Wang, Anup Bhalla, John Chen, Hong Chang | 2016-01-26 |
| 9245861 | Wafer process for molded chip scale package (MCSP) with thick backside metallization | Yan Xun Xue, Yueh-Se Ho, Jun Lu, Zhiqiang Niu, Guo Feng Lian +2 more | 2016-01-26 |
| 9230949 | Method of making stacked multi-chip packaging structure | Xiaotian Zhang, Hua Pan, Ming-Chen Lu, Jun Lu | 2016-01-05 |
| 9231050 | Configuration and method to generate saddle junction electric field in edge termination | Madhur Bobde, Lingping Guan, Anup Bhalla | 2016-01-05 |
| 9224603 | Method of fabricating power transistor with protected channel | Yang Lu, Budong You, Marco A. Zuniga | 2015-12-29 |
| 9214417 | Combined packaged power semiconductor device | Yueh-Se Ho, Yan Xun Xue, Jun Lu | 2015-12-15 |
| 9214419 | Power semiconductor device and preparation method thereof | Yan Xun Xue, Yueh-Se Ho, Jun Lu | 2015-12-15 |
| 9196534 | Method for preparing semiconductor devices applied in flip chip technology | Yan Xun Xue, Ping Huang, Yueh-Se Ho, Lei Shi, Liang Zhao +3 more | 2015-11-24 |
| 9190512 | High density trench-based power MOSFETs with self-aligned active contacts and method for making such devices | Yeeheng Lee, Hong Chang, Jongoh Kim, Sik Lui, Madhur Bobde +2 more | 2015-11-17 |