Issued Patents All Time
Showing 76–100 of 265 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9666666 | Dual-gate trench IGBT with buried floating P-type shield | Jun Hu, Madhur Bobde | 2017-05-30 |
| 9653383 | Semiconductor device with thick bottom metal and preparation method thereof | Yan Xun Xue, Jun Lu, Ming-Chen Lu, Yan Huo, Aihua Lu | 2017-05-16 |
| 9620630 | Injection control in semiconductor power devices | Madhur Bobde, Jun Hu, Lingpeng Guan, Lei Zhang, Jongoh Kim | 2017-04-11 |
| 9595609 | Semiconductor device including superjunction structure formed using angled implant process | Karthik Padmanabhan, Madhur Bobde, Lingpeng Guan, Lei Zhang | 2017-03-14 |
| 9595587 | Split poly connection via through-poly-contact (TPC) in split-gate based power MOSFETs | Yeeheng Lee, Sik Lui, Jongoh Kim, Hong Chang, Madhur Bobde +1 more | 2017-03-14 |
| 9577072 | Termination design for high voltage device | Lingpeng Guan, Anup Bhalla | 2017-02-21 |
| 9564406 | Battery protection package and process of making the same | Zhiqiang Niu, Yan Xun Xue, Man Sheng Hu, Jun Lu, Yueh-Se Ho | 2017-02-07 |
| 9548352 | Semiconductor device with field threshold MOSFET for high voltage termination | Madhur Bobde | 2017-01-17 |
| 9530885 | Normally on high voltage switch | Madhur Bobde, Daniel Calafut, Karthik Padmanabhan | 2016-12-27 |
| 9520380 | Wafer process for molded chip scale package (MCSP) with thick backside metallization | Yan Xun Xue, Yueh-Se Ho, Jun Lu, Zhiqiang Niu, Guo Feng Lian | 2016-12-13 |
| 9520464 | Configuration and method to generate saddle junction electric field in edge termination | Madhur Bobde, Lingpeng Guan, Anup Bhalla | 2016-12-13 |
| 9508805 | Termination design for nanotube MOSFET | Lingpeng Guan, Madhur Bobde, Karthik Padmanabhan | 2016-11-29 |
| 9502554 | High frequency switching MOSFETs with low output capacitance using a depletable P-shield | Madhur Bobde, Sik Lui, Daniel Ng | 2016-11-22 |
| 9502503 | Nanotube semiconductor devices | Xiaobin Wang, Anup Bhalla, John Chen, Hong Chang | 2016-11-22 |
| 9484452 | Integrating enhancement mode depleted accumulation/inversion channel devices with MOSFETs | Madhur Bobde, Sik Lui, Jongoh Kim, Daniel Ng | 2016-11-01 |
| 9484453 | Device structure and methods of making high density MOSFETs for load switch and DC-DC applications | Madhur Bobde, Hong Chang, Yeeheng Lee, Daniel Calafut, Jongoh Kim +2 more | 2016-11-01 |
| 9472491 | Semiconductor package with small gate clip and assembly method | Yan Xun Xue, Yueh-Se Ho, Jun Lu, Ming-Chen Lu, Hongtao Gao | 2016-10-18 |
| 9450045 | Method for forming lateral super-junction structure | Madhur Bobde, Lingpeng Guan, Karthik Padmanabhan | 2016-09-20 |
| 9450050 | Lateral super junctions with high substrate breakdown and build in avalanche clamp diode | Madhur Bobde, Anup Bhalla, Wilson Ma, Lingping Guan, Yeeheng Lee +1 more | 2016-09-20 |
| 9450083 | High voltage field balance metal oxide field effect transistor (FBM) | Anup Bhalla, Madhur Bobde, Lingpeng Guan, Jun Hu, Jongoh Kim +1 more | 2016-09-20 |
| 9450088 | High density trench-based power MOSFETs with self-aligned active contacts and method for making such devices | Yeeheng Lee, Hong Chang, Jongoh Kim, Sik Lui, Madhur Bobde +2 more | 2016-09-20 |
| 9437587 | Flip chip semiconductor device | Xiaotian Zhang, Jun Lu, Xiaoguang Zeng, Ming-Chen Lu | 2016-09-06 |
| 9437530 | Combined packaged power semiconductor device | Yueh-Se Ho, Yan Yun Xue, Jun Lu | 2016-09-06 |
| 9431328 | Power device and preparation method thereof | Yan Xun Xue, Jun Lu | 2016-08-30 |
| 9425181 | Method of hybrid packaging a lead frame based multi-chip semiconductor device with multiple interconnecting structures | Yan Xun Xue, Jun Lu, Peter H. Wilson, Yan Huo, Zhiqiang Niu +1 more | 2016-08-23 |