Issued Patents 2023
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854945 | Underfill material flow control for reduced die-to-die spacing in semiconductor packages | Omkar G. Karhade, Nitin A. Deshpande, Rajendra C. Dias, Lars D. Skoglund | 2023-12-26 |
| 11832419 | Full package vapor chamber with IHS | Nicholas Neal, Nicholas S. Haehn, Je-Young Chang, Kyle Arrington, Aaron McCann +4 more | 2023-11-28 |
| 11791274 | Multichip semiconductor package including a bridge die disposed in a cavity having non-planar interconnects | Manish Dubey, Omkar G. Karhade, Nitin A. Deshpande, Jinhe Liu, Sairam Agraharam +1 more | 2023-10-17 |
| 11776821 | Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap | Ziyin Lin, Vipul V. Mehta, Yuying Wei, Sushrutha Gujjula, Nisha Ananthakrishnan +1 more | 2023-10-03 |
| 11776864 | Corner guard for improved electroplated first level interconnect bump height range | Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho, Rahul Jain +4 more | 2023-10-03 |
| 11769753 | Thermally-optimized tunable stack in cavity package-on-package | George Vakanas, Aastha Uppal, Shereen ELHALAWATY, Aaron McCann, Tannaz Harirchian +1 more | 2023-09-26 |
| 11735495 | Active package cooling structures using molded substrate packaging technology | Omkar G. Karhade, Mitul Modi, Aastha Uppal | 2023-08-22 |
| 11646274 | Multi-package assemblies having foam structures for warpage control | Mufei Yu, Gang Duan, Baris Bicen, Rahul N. Manepalli | 2023-05-09 |
| 11574851 | Coupled cooling fins in ultra-small systems | Aastha Uppal, Omkar G. Karhade, Ram Viswanath, Je-Young Chang, Weihua Tang +6 more | 2023-02-07 |
| 11551994 | Liquid metal TIM with STIM-like performance with no BSM and BGA compatible | Kelly Lofgreen, Chia-Pin Chiu, Joseph Petrini, Betsegaw K. Gebrehiwot, Feras Eid | 2023-01-10 |
| 11545407 | Thermal management solutions for integrated circuit packages | Kumar Abhishek Singh, Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Aastha Uppal +8 more | 2023-01-03 |