Issued Patents 2020
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847352 | Compensating chamber and process effects to improve critical dimension variation for trim process | Pulkit Agarwal, Ravi Kumar, Purushottam Kumar | 2020-11-24 |
| 10832909 | Atomic layer etch, reactive precursors and energetic sources for patterning applications | Puikit Agarwal, Purushottam Kumar | 2020-11-10 |
| 10832908 | Self-aligned multi-patterning process flow with ALD gapfill spacer mask | — | 2020-11-10 |
| 10831096 | Vacuum-integrated hardmask processes and apparatus | Jeffrey Marks, George Andrew Antonelli, Richard A. Gottscho, Dennis M. Hausmann, Thomas Knisley +3 more | 2020-11-10 |
| 10801109 | Method and apparatus for providing station to station uniformity | Pulkit Agarwal | 2020-10-13 |
| 10741458 | Methods for depositing films on sensitive substrates | Hu Kang, Shankar Swaminathan, Jon Henri | 2020-08-11 |
| 10741365 | Low volume showerhead with porous baffle | Ramesh Chandrasekharan, Saangrut Sangplung, Shankar Swaminathan, Frank L. Pasquale, Hu Kang | 2020-08-11 |
| 10727046 | Surface modified depth controlled deposition for plasma based deposition | Joseph R. Abel, Purushottam Kumar | 2020-07-28 |
| 10727143 | Method for controlling core critical dimension variation using flash trim sequence | Pulkit Agarwal, Ravi Kumar, Purushottam Kumar | 2020-07-28 |
| 10679848 | Selective atomic layer deposition with post-dose treatment | Purushottam Kumar, Ishtak Karim, Jun Qian, Frank L. Pasquale, Bart J. van Schravendijk | 2020-06-09 |
| 10665429 | Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformity | Hu Kang, Shankar Swaminathan, Jun Qian, Chloe Baldasseroni, Frank L. Pasquale +8 more | 2020-05-26 |
| 10655224 | Conical wafer centering and holding device for semiconductor processing | Pulkit Agarwal, Ishtak Karim, Purushottam Kumar, Sung Je Kim, Patrick Breiling | 2020-05-19 |
| 10658172 | Dielectric gapfill of high aspect ratio features utilizing a sacrificial etch cap layer | Joseph R. Abel, Pulkit Agarwal, Richard Phillips, Purushottam Kumar | 2020-05-19 |
| 10636686 | Method monitoring chamber drift | Joseph R. Abel, Purushottam Kumar | 2020-04-28 |
| 10629435 | Doped ALD films for semiconductor patterning applications | Shankar Swaminathan, Richard Phillips | 2020-04-21 |
| 10622243 | Planar substrate edge contact with open volume equalization pathways and side containment | Patrick Breiling, Ramesh Chandrasekharan, Karl Leeser, Paul Konkola, Chloe Baldasseroni +7 more | 2020-04-14 |
| 10577688 | Tandem source activation for CVD of films | Hu Kang, Karl Leeser | 2020-03-03 |
| 10577691 | Single ALD cycle thickness control in multi-station substrate deposition systems | Romuald Nowak, Hu Kang, Jun Qian | 2020-03-03 |
| 10566187 | Ultrathin atomic layer deposition film accuracy thickness control | Jun Qian, Hu Kang, Seiji Matsuyama, Purushottam Kumar | 2020-02-18 |
| 10559468 | Capped ALD films for doping fin-shaped channel regions of 3-D IC transistors | Reza Arghavani, Samantha Tan, Bhadri N. Varadarajan, Ananda Banerji, Jun Qian +1 more | 2020-02-11 |
| 10526701 | Multi-cycle ALD process for film uniformity and thickness profile modulation | Purushottam Kumar, Hu Kang, Jun Qian, Tuan Nguyen, Ye Wang | 2020-01-07 |
| 10526700 | Hardware and process for film uniformity improvement | Purushottam Kumar, Hu Kang, Yi Chung Chiu, Frank L. Pasquale, Jun Qian +5 more | 2020-01-07 |