Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840061 | Substrate processing chamber including conical surface for reducing recirculation | Ryan Blaquiere, Shankar Swaminathan | 2020-11-17 |
| 10697059 | Thickness compensation by modulation of number of deposition cycles as a function of chamber accumulation for wafer to wafer film thickness matching | Chloe Baldasseroni, Nishanth Manjunath | 2020-06-30 |
| 10658172 | Dielectric gapfill of high aspect ratio features utilizing a sacrificial etch cap layer | Joseph R. Abel, Pulkit Agarwal, Purushottam Kumar, Adrien LaVoie | 2020-05-19 |
| 10629435 | Doped ALD films for semiconductor patterning applications | Shankar Swaminathan, Adrien LaVoie | 2020-04-21 |