Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10697059 | Thickness compensation by modulation of number of deposition cycles as a function of chamber accumulation for wafer to wafer film thickness matching | Richard Phillips, Nishanth Manjunath | 2020-06-30 |
| 10665429 | Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformity | Hu Kang, Adrien LaVoie, Shankar Swaminathan, Jun Qian, Frank L. Pasquale +8 more | 2020-05-26 |
| 10648079 | Reducing backside deposition at wafer edge | Andrew Duvall, Ryan Blaquiere, Shankar Swaminathan | 2020-05-12 |
| 10622243 | Planar substrate edge contact with open volume equalization pathways and side containment | Patrick Breiling, Ramesh Chandrasekharan, Karl Leeser, Paul Konkola, Adrien LaVoie +7 more | 2020-04-14 |
| 10541117 | Systems and methods for tilting a wafer for achieving deposition uniformity | Shankar Swaminathan, Pramod Subramonium, Frank L. Pasquale, Jeongseok Ha | 2020-01-21 |
| 10526700 | Hardware and process for film uniformity improvement | Purushottam Kumar, Hu Kang, Adrien LaVoie, Yi Chung Chiu, Frank L. Pasquale +5 more | 2020-01-07 |