Issued Patents 2020
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847352 | Compensating chamber and process effects to improve critical dimension variation for trim process | Pulkit Agarwal, Adrien LaVoie, Ravi Kumar | 2020-11-24 |
| 10832909 | Atomic layer etch, reactive precursors and energetic sources for patterning applications | Adrien LaVoie, Puikit Agarwal | 2020-11-10 |
| 10727046 | Surface modified depth controlled deposition for plasma based deposition | Joseph R. Abel, Adrien LaVoie | 2020-07-28 |
| 10727143 | Method for controlling core critical dimension variation using flash trim sequence | Pulkit Agarwal, Adrien LaVoie, Ravi Kumar | 2020-07-28 |
| 10679848 | Selective atomic layer deposition with post-dose treatment | Adrien LaVoie, Ishtak Karim, Jun Qian, Frank L. Pasquale, Bart J. van Schravendijk | 2020-06-09 |
| 10658172 | Dielectric gapfill of high aspect ratio features utilizing a sacrificial etch cap layer | Joseph R. Abel, Pulkit Agarwal, Richard Phillips, Adrien LaVoie | 2020-05-19 |
| 10655224 | Conical wafer centering and holding device for semiconductor processing | Pulkit Agarwal, Ishtak Karim, Adrien LaVoie, Sung Je Kim, Patrick Breiling | 2020-05-19 |
| 10636686 | Method monitoring chamber drift | Joseph R. Abel, Adrien LaVoie | 2020-04-28 |
| 10566187 | Ultrathin atomic layer deposition film accuracy thickness control | Jun Qian, Hu Kang, Adrien LaVoie, Seiji Matsuyama | 2020-02-18 |
| 10526700 | Hardware and process for film uniformity improvement | Hu Kang, Adrien LaVoie, Yi Chung Chiu, Frank L. Pasquale, Jun Qian +5 more | 2020-01-07 |
| 10526701 | Multi-cycle ALD process for film uniformity and thickness profile modulation | Adrien LaVoie, Hu Kang, Jun Qian, Tuan Nguyen, Ye Wang | 2020-01-07 |