Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12191117 | Compact low angle ion beam extraction assembly and processing apparatus | Costel Biloiu, Jay Wallace, Solomon Belangedi Basame, Tyler Rockwell | 2025-01-07 |
| 12106943 | Substrate halo arrangement for improved process uniformity | Jay Wallace, Simon Ruffell, Tyler Rockwell, Christopher Campbell, Kevin M. Daniels +2 more | 2024-10-01 |
| 11664193 | Temperature controlled/electrically biased wafer surround | Simon Ruffell, Kevin Verrier | 2023-05-30 |
| 11646213 | Multi-zone platen temperature control | Simon Ruffell | 2023-05-09 |
| 11640909 | Techniques and apparatus for unidirectional hole elongation using angled ion beams | Simon Ruffell | 2023-05-02 |
| 11495434 | In-situ plasma cleaning of process chamber components | William Davis Lee, Peter F. Kurunczi, Ryan Downey, Jay T. Scheuer, Alexandre Likhanskii +1 more | 2022-11-08 |
| 11127593 | Techniques and apparatus for elongation patterning using angled ion beams | Simon Ruffell | 2021-09-21 |
| 11053580 | Techniques for selective deposition using angled ions | Maureen Petterson | 2021-07-06 |
| 11037758 | In-situ plasma cleaning of process chamber components | William Davis Lee, Peter F. Kurunczi, Ryan Downey, Jay T. Scheuer, Alexandre Likhanskii +1 more | 2021-06-15 |
| 10879055 | Techniques, system and apparatus for selective deposition of a layer using angled ions | Christopher R. Hatem | 2020-12-29 |
| 10847372 | Workpiece processing technique | Morgan Evans, Ross Bandy | 2020-11-24 |
| 10665421 | In-situ beam profile metrology | Tsung-Liang Chen, Simon Ruffell | 2020-05-26 |
| 10553448 | Techniques for processing a polycrystalline layer using an angled ion beam | Tristan Y. Ma, Morgan Evans, Robert Masci, John Hautala | 2020-02-04 |
| 10522330 | In-situ plasma cleaning of process chamber components | William Davis Lee, Peter F. Kurunczi, Ryan Downey, Jay T. Scheuer, Alexandre Likhanskii +1 more | 2019-12-31 |
| 10410844 | RF clean system for electrostatic elements | Brant S. Binns, Peter F. Kurunczi, Jay T. Scheuer, Eric D. Hermanson, Alexandre Likhanskii | 2019-09-10 |
| 10269663 | Critical dimensions variance compensation | Morgan Evans, Tristan Y. Ma, Motoya Okazaki, Johannes M. van Meer | 2019-04-23 |
| 10222202 | Three dimensional structure fabrication control using novel processing system | Morgan Evans, Simon Ruffell, Tristan Y. Ma | 2019-03-05 |
| 10002764 | Sputter etch material selectivity | Tristan Y. Ma, Morgan Evans, John Hautala, Heyun Yin | 2018-06-19 |
| 9287148 | Dynamic heating method and system for wafer processing | Morgan Evans, D. Jeffrey Lischer, William T. Weaver, Jason M. Schaller, Robert Brent Vopat | 2016-03-15 |