Issued Patents All Time
Showing 76–100 of 202 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715717 | Methods of forming integrated circuit packages having adhesion layers over through vias | Hung-Chun Cho, Sih-Hao Liao, Hung-Jui Kuo | 2023-08-01 |
| 11699598 | Semiconductor device | Zi-Jheng Liu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo, Hung-Jui Kuo +3 more | 2023-07-11 |
| 11694967 | Package structure and method of fabricating the same | Jhih-Yu Wang, Hung-Jui Kuo, Sih-Hao Liao, Yung-Chi Chu | 2023-07-04 |
| 11682647 | Semiconductor package and method for manufacturing the same | Po-Han Wang, Hung-Jui Kuo, Shih-Peng Tai, I-Chia Chen | 2023-06-20 |
| 11682637 | Air channel formation in packaging process | Wan-Yu Lee, Chiang Lin, Yueh-Ting Lin, Hua-Wei Tseng, Li-Hsien Huang | 2023-06-20 |
| 11682636 | Info structure and method forming same | Po-Han Wang, Hung-Jui Kuo, Chen-Hua Yu | 2023-06-20 |
| 11670519 | Redistribution structures for semiconductor packages and methods of forming the same | Hung-Jui Kuo, Chen-Hua Yu | 2023-06-06 |
| 11664323 | Semiconductor package and method | Po-Han Wang, Hung-Jui Kuo | 2023-05-30 |
| 11640935 | Semiconductor package and manufacturing method thereof | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +7 more | 2023-05-02 |
| 11614413 | Back scattering inspection system and back scattering inspection method | Jianmin Li, Li Zhang, Yuanjing Li, Zhiqiang Chen, Hao Yu +6 more | 2023-03-28 |
| 11605607 | Semiconductor device and methods of manufacture | Hung-Chun Cho, Hung-Jui Kuo, Sih-Hao Liao | 2023-03-14 |
| 11600592 | Package | Tian Hu, Hung-Jui Kuo, Sih-Hao Liao | 2023-03-07 |
| 11594472 | Package structure and method of forming the same | Hung-Chun Cho, Hung-Jui Kuo, Sih-Hao Liao, Wei-Chih Chen | 2023-02-28 |
| 11573322 | Laser speed measuring method, control device and laser velocimeter | Jian Li, Shangmin Sun, Yongming Wang, Yanwei Xu, Weifeng Yu +1 more | 2023-02-07 |
| 11532540 | Planarizing RDLS in RDL-first processes through CMP process | Po-Han Wang, Hung-Jui Kuo, Chen-Hua Yu | 2022-12-20 |
| 11532531 | Semiconductor package | Po-Han Wang, Hung-Jui Kuo, Sih-Hao Liao | 2022-12-20 |
| 11456280 | Semiconductor package and method of forming the same | Wei-Chih Chen, Hung-Jui Kuo, Sih-Hao Liao, Hung-Chun Cho | 2022-09-27 |
| 11454888 | Semiconductor device and method of manufacture | Sih-Hao Liao, Hung-Jui Kuo, Chen-Hua Yu | 2022-09-27 |
| 11450603 | Semiconductor device and method of fabricating the same | Sih-Hao Liao, Hung-Jui Kuo | 2022-09-20 |
| 11422070 | Sampling probe, automatic sampling device, and container detection system | Qingjun Zhang, Yuanjing Li, Zhiqiang Chen, Jianmin Li, Shangmin Sun +7 more | 2022-08-23 |
| 11417582 | Package structure and method of manufacturing the same | Wei-Chih Chen, Hung-Jui Kuo, Sih-Hao Liao, Hung-Chun Cho | 2022-08-16 |
| 11404342 | Package structure comprising buffer layer for reducing thermal stress and method of forming the same | Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo +3 more | 2022-08-02 |
| 11393749 | Stacked via structure | Po-Han Wang, Hung-Jui Kuo | 2022-07-19 |
| 11355378 | Fan-out interconnect structure and methods forming the same | Chung-Shi Liu, Hung-Jui Kuo, Ming-Da Cheng | 2022-06-07 |
| 11342296 | Semiconductor structure, semiconductor package and method of fabricating the same | Wei-Chih Chen, Hung-Jui Kuo, Sih-Hao Liao, Po-Han Wang | 2022-05-24 |