Issued Patents All Time
Showing 51–75 of 202 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11923207 | Redistribution structures for semiconductor packages and methods of forming the same | Hung-Jui Kuo, Chen-Hua Yu | 2024-03-05 |
| 11894336 | Integrated fan-out package and manufacturing method thereof | Jhih-Yu Wang, Hung-Jui Kuo, Sih-Hao Liao, Yung-Chi Chu | 2024-02-06 |
| 11892774 | Lithography | Meng-Che Tu, Po-Han Wang, Sih-Hao Liao, Hung-Jui Kuo | 2024-02-06 |
| 11868047 | Polymer layer in semiconductor device and method of manufacture | Sih-Hao Liao, Hung-Jui Kuo, Chen-Hua Yu | 2024-01-09 |
| 11862594 | Package structure with solder resist underlayer for warpage control and method of manufacturing the same | Ting-Chen Tseng, Hung-Jui Kuo, Sih-Hao Liao | 2024-01-02 |
| 11862560 | Package structure and method of manufacturing the same | Yung-Chi Chu, Hung-Jui Kuo, Wei-Chih Chen | 2024-01-02 |
| 11854927 | Semiconductor package and method of forming same | Ting-Chen Tseng, Sih-Hao Liao, Hung-Jui Kuo | 2023-12-26 |
| 11854997 | Method of forming semiconductor device | Jhih-Yu Wang, Yung-Chi Chu, Sih-Hao Liao, Hung-Jui Kuo | 2023-12-26 |
| 11842902 | Semiconductor package with alignment mark and manufacturing method thereof | Po-Han Wang, Hung-Jui Kuo | 2023-12-12 |
| 11837502 | Semiconductor package and methods of forming the same | Meng-Che Tu, Wei-Chih Chen, Sih-Hao Liao, Hung-Jui Kuo, Chen-Hua Yu | 2023-12-05 |
| 11822043 | Radiation inspection apparatus comprising a radiation inspection device and wheels and radiation inspection method | Zhiqiang Chen, Yuanjing Li, Li Zhang, Jianmin Li, Shangmin Sun +6 more | 2023-11-21 |
| 11822040 | Security scanning inspection system and method | Yanwei Xu, Weifeng Yu, Chunguang Zong, Shangmin Sun | 2023-11-21 |
| 11817399 | Semiconductor device | Zi-Jheng Liu, Jo-Lin Lan, Hung-Jui Kuo | 2023-11-14 |
| 11817352 | Method of fabricating redistribution circuit structure | Po-Han Wang, Hung-Jui Kuo | 2023-11-14 |
| 11812002 | Method and device for correcting a scanned image and image scanning system | Bicheng Liu, Hao Yu, Weizhen Wang, Guangming Xu, Haojie Chi +2 more | 2023-11-07 |
| 11798893 | Semiconductor package and manufacturing method thereof | Yung-Chi Chu, Hung-Jui Kuo, Jhih-Yu Wang | 2023-10-24 |
| 11798857 | Composition for sacrificial film, package, manufacturing method of package | Yung-Chi Chu, Hung-Jui Kuo, Sih-Hao Liao | 2023-10-24 |
| 11791313 | Semiconductor package and method of forming the same | Wei-Chih Chen, Hung-Jui Kuo, Sih-Hao Liao, Hung-Chun Cho | 2023-10-17 |
| 11768312 | Security inspection device and transfer method therefor | Quanwei Song, Xuping Fan, Junping Shi, Yuan He, Hui Meng +3 more | 2023-09-26 |
| 11768338 | Optical interconnect structure, package structure and fabricating method thereof | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +5 more | 2023-09-26 |
| 11764124 | Sensing component encapsulated by an encapsulant with a roughness surface having a hollow region | Yung-Chi Chu, Hung-Jui Kuo, Sih-Hao Liao, Tian Hu | 2023-09-19 |
| 11747510 | Security inspection device | Chunguang Zong, Quanwei Song, Kejin Gao, Shangmin Sun, Junping Shi +3 more | 2023-09-05 |
| 11728181 | Semiconductor device and method | Sih-Hao Liao, Hung-Jui Kuo, Chen-Hua Yu | 2023-08-15 |
| 11721635 | Chip package and method of forming the same | Chen-Hua Yu, Hung-Jui Kuo | 2023-08-08 |
| 11721603 | Integrated fan out method utilizing a filler-free insulating material | Wei-Chih Chen, Sih-Hao Liao, Hung-Jui Kuo | 2023-08-08 |