Issued Patents All Time
Showing 26–50 of 202 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12191222 | Integrated fan out device with a filler-free insulating material | Wei-Chih Chen, Sih-Hao Liao, Hung-Jui Kuo | 2025-01-07 |
| 12176282 | Manufacturing method of semiconductor package | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +7 more | 2024-12-24 |
| 12170223 | Method of fabricating redistribution circuit structure | Po-Han Wang, Hung-Jui Kuo | 2024-12-17 |
| 12165966 | Package and method of manufacturing the same | Meng-Che Tu, Sih-Hao Liao, Hung-Jui Kuo | 2024-12-10 |
| 12147159 | Semiconductor device and method of manufacture | Sih-Hao Liao, Hung-Jui Kuo, Chen-Hua Yu | 2024-11-19 |
| 12119229 | Method of manufacturing semiconductor structure | Wei-Yu Chen, Hung-Jui Kuo, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2024-10-15 |
| 12119235 | Methods of manufacture of semiconductor devices having redistribution layer using dielectric material having photoactive component | Wei-Chih Chen, Hung-Jui Kuo, Sih-Hao Liao | 2024-10-15 |
| 12094765 | Integrated circuit package and method | Ting-Chen Tseng, Sih-Hao Liao, Po-Han Wang, Hung-Jui Kuo | 2024-09-17 |
| 12094728 | Semiconductor device | Zi-Jheng Liu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo, Hung-Jui Kuo +3 more | 2024-09-17 |
| 12087654 | Sensing die encapsulated by an encapsulant with a roughness surface having a hollow region | Yung-Chi Chu, Hung-Jui Kuo, Sih-Hao Liao, Tian Hu | 2024-09-10 |
| 12068273 | Package | Tian Hu, Hung-Jui Kuo, Sih-Hao Liao | 2024-08-20 |
| 12033883 | Fan-out interconnect structure and methods forming the same | Chung-Shi Liu, Hung-Jui Kuo, Ming-Da Cheng | 2024-07-09 |
| 12020518 | Vehicle inspection method, apparatus and system, and computer-readable storage medium | Yongming Wang, Junjie Tu, Chuan Gao, Yanwei Xu, Weifeng Yu +1 more | 2024-06-25 |
| 12009331 | Integrated circuit packages having adhesion layers for through vias | Hung-Chun Cho, Sih-Hao Liao, Hung-Jui Kuo | 2024-06-11 |
| 12009226 | Semiconductor device and method of forming same | Ting-Chen Tseng, Sih-Hao Liao, Hung-Jui Kuo | 2024-06-11 |
| 11984410 | Air channel formation in packaging process | Wan-Yu Lee, Chiang Lin, Yueh-Ting Lin, Hua-Wei Tseng, Li-Hsien Huang | 2024-05-14 |
| 11973023 | Stacked via structure | Po-Han Wang, Hung-Jui Kuo | 2024-04-30 |
| 11961777 | Package structure comprising buffer layer for reducing thermal stress and method of forming the same | Wei-Chih Chen, Chien-Hsun Lee, Chung-Shi Liu, Hao-Cheng Hou, Hung-Jui Kuo +3 more | 2024-04-16 |
| 11952027 | Train identification system and method, and train safety inspection system and method | Yanwei Xu, Weifeng Yu, Shangmin Sun | 2024-04-09 |
| 11948918 | Redistribution structure for semiconductor device and method of forming same | Po-Han Wang, Hung-Jui Kuo | 2024-04-02 |
| 11948904 | Die and package structure | Wei-Chih Chen, Hung-Jui Kuo, Sih-Hao Liao | 2024-04-02 |
| 11948863 | Package structure and method of forming the same | Hung-Chun Cho, Hung-Jui Kuo, Sih-Hao Liao, Wei-Chih Chen | 2024-04-02 |
| 11942435 | Semiconductor package and method | Po-Han Wang, Hung-Jui Kuo | 2024-03-26 |
| 11942417 | Sensor package and method | Yung-Chi Chu, Sih-Hao Liao, Po-Han Wang, Hung-Jui Kuo | 2024-03-26 |
| 11933934 | Security inspection device and transfer method therefor | Xuping Fan, Quanwei Song, Shangmin Sun | 2024-03-19 |