Issued Patents All Time
Showing 101–125 of 202 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322360 | Method of manufacturing semiconductor structure | Wei-Yu Chen, Hung-Jui Kuo, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2022-05-03 |
| 11322450 | Chip package and method of forming the same | Chen-Hua Yu, Hung-Jui Kuo | 2022-05-03 |
| 11289396 | Sensing component encapsulated by an encapsulation layer with a roughness surface having a hollow region | Yung-Chi Chu, Hung-Jui Kuo, Sih-Hao Liao, Tian Hu | 2022-03-29 |
| 11289426 | Semiconductor package and manufacturing method thereof | Yung-Chi Chu, Hung-Jui Kuo, Jhih-Yu Wang | 2022-03-29 |
| 11282804 | Package structure and method of manufacturing the same | Wei-Chih Chen, Hung-Jui Kuo, Sih-Hao Liao | 2022-03-22 |
| 11276647 | Method of forming semiconductor device | Jhih-Yu Wang, Yung-Chi Chu, Sih-Hao Liao, Hung-Jui Kuo | 2022-03-15 |
| 11270927 | Package structure and method of forming the same | Hung-Chun Cho, Hung-Jui Kuo, Sih-Hao Liao, Wei-Chih Chen | 2022-03-08 |
| 11227795 | Integrated circuit package and method | Ting-Chen Tseng, Sih-Hao Liao, Po-Han Wang, Hung-Jui Kuo | 2022-01-18 |
| 11201079 | Wafer chuck | Sih-Hao Liao, Chen-Hua Yu, Hung-Jui Kuo, Wei-Chih Chen | 2021-12-14 |
| 11177165 | Method of manufacturing a semiconductor device having redistribution layer including a dielectric layer made from a low-temperature cure polyimide | Zi-Jheng Liu, Hung-Jui Kuo | 2021-11-16 |
| 11171098 | Package and manufacturing method thereof | Tian Hu, Hung-Jui Kuo | 2021-11-09 |
| 11164814 | Package structure and method of manufacturing the same | Yung-Chi Chu, Hung-Jui Kuo, Wei-Chih Chen | 2021-11-02 |
| 11164839 | Package structure and method of manufacturing the same | Wei-Chih Chen, Hung-Jui Kuo, Sih-Hao Liao, Po-Han Wang, Yung-Chi Chu +1 more | 2021-11-02 |
| 11133265 | Integrated fan-out package and method of fabricating the same | Hung-Jui Kuo, Yi-Wen Wu | 2021-09-28 |
| 11121299 | Semiconductor device and method | Tian Hu, Hung-Jui Kuo, Chen-Hua Yu | 2021-09-14 |
| 11121006 | Semiconductor package comprising molding compound having extended portion and manufacturing method of semiconductor package | Po-Han Wang, Hung-Jui Kuo | 2021-09-14 |
| 11114407 | Integrated fan-out package and manufacturing method thereof | Jhih-Yu Wang, Hung-Jui Kuo, Sih-Hao Liao, Yung-Chi Chu | 2021-09-07 |
| 11101176 | Method of fabricating redistribution circuit structure | Po-Han Wang, Hung-Jui Kuo | 2021-08-24 |
| 11088094 | Air channel formation in packaging process | Wan-Yu Lee, Chiang Lin, Yueh-Ting Lin, Hua-Wei Tseng, Li-Hsien Huang | 2021-08-10 |
| 11062915 | Redistribution structures for semiconductor packages and methods of forming the same | Hung-Jui Kuo, Chen-Hua Yu | 2021-07-13 |
| 11049812 | Semiconductor devices and methods of forming the same | Sih-Hao Liao, Hung-Jui Kuo, Meng-Che Tu | 2021-06-29 |
| 11031289 | Semiconductor package and methods of forming the same | Meng-Che Tu, Wei-Chih Chen, Sih-Hao Liao, Hung-Jui Kuo, Chen-Hua Yu | 2021-06-08 |
| 11031351 | Method of manufacturing a semiconductor device | Zi-Jheng Liu, Jo-Lin Lan, Hung-Jui Kuo | 2021-06-08 |
| 11004796 | Integrated fan-out package | Meng-Che Tu, Hung-Jui Kuo, Sih-Hao Liao | 2021-05-11 |
| 10998202 | Semiconductor package and manufacturing method thereof | Po-Han Wang, Hung-Jui Kuo | 2021-05-04 |