Issued Patents All Time
Showing 126–150 of 202 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10978405 | Integrated fan-out package | Jhih-Yu Wang, Hung-Jui Kuo, Sih-Hao Liao | 2021-04-13 |
| 10964650 | Info structure and method forming same | Po-Han Wang, Hung-Jui Kuo, Chen-Hua Yu | 2021-03-30 |
| 10879147 | Method of manufacturing package structure | Po-Han Wang, Hung-Jui Kuo | 2020-12-29 |
| 10872864 | Semiconductor package and method | Po-Han Wang, Hung-Jui Kuo | 2020-12-22 |
| 10867811 | Semiconductor device | Zi-Jheng Liu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo, Hung-Jui Kuo +3 more | 2020-12-15 |
| 10861809 | Semiconductor structure and method of forming | Chen-Hua Yu, Hung-Jui Kuo | 2020-12-08 |
| 10854569 | Package structure, semiconductor device and method of fabricating the same | Wei-Chih Chen, Hung-Jui Kuo, Sih-Hao Liao, Po-Han Wang | 2020-12-01 |
| 10833053 | Semiconductor package and method of forming the same | Wei-Chih Chen, Hung-Jui Kuo, Sih-Hao Liao, Hung-Chun Cho | 2020-11-10 |
| 10797023 | Integrated fan-out package and method of fabricating an integrated fan-out package | Hung-Jui Kuo, Sih-Hao Liao | 2020-10-06 |
| 10790212 | Method of manufacturing package structure | Po-Han Wang, Hung-Jui Kuo | 2020-09-29 |
| 10763206 | Method of fabricating integrated fan-out packages | Po-Han Wang, Hung-Jui Kuo | 2020-09-01 |
| 10718128 | Vehicle inspection system, method and smart garage | Zhiqiang Chen, Yuanjing Li, Jianmin Li, Shangmin Sun, Yuan Ma +1 more | 2020-07-21 |
| 10714414 | Planarizing RDLS in RDL—First Processes Through CMP Process | Po-Han Wang, Hung-Jui Kuo, Chen-Hua Yu | 2020-07-14 |
| 10707084 | Method of manufacturing wafer level chip scale package | Wei-Yu Chen, Hung-Jui Kuo, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2020-07-07 |
| 10690803 | Mobile scanning inspection system | Tao Jiang, Yanwei Xu, Shangmin Sun, Weifeng Yu, Xuejing Yang +3 more | 2020-06-23 |
| 10685896 | Integrated circuit package and method of fabricating the same | Zi-Jheng Liu, Hung-Jui Kuo | 2020-06-16 |
| 10665545 | Semiconductor devices, semiconductor packages and methods of forming the same | Sih-Hao Liao, Hung-Jui Kuo, Meng-Che Tu | 2020-05-26 |
| 10658199 | Semiconductor device and method | Sih-Hao Liao, Hung-Jui Kuo, Chen-Hua Yu | 2020-05-19 |
| 10658287 | Semiconductor device having a tapered protruding pillar portion | Sih-Hao Liao, Hung-Jui Kuo | 2020-05-19 |
| 10658208 | Polyimide composition for package structure, package structure and method of fabricating the same | Sih-Hao Liao, Hung-Jui Kuo | 2020-05-19 |
| 10641717 | Movable article inspention system and inspection method | Zhiqiang Chen, Yuanjing Li, Shangmin Sun, Xuejing Yang, Qiangqiang Wang +2 more | 2020-05-05 |
| 10607941 | Method of forming semiconductor device | Jhih-Yu Wang, Yung-Chi Chu, Sih-Hao Liao, Hung-Jui Kuo | 2020-03-31 |
| 10586724 | Fan-out interconnect structure and methods forming the same | Chung-Shi Liu, Hung-Jui Kou, Ming-Da Cheng | 2020-03-10 |
| 10535616 | Warpage control in package-on-package structures | Wei-Yu Chen, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2020-01-14 |
| 10529593 | Semiconductor package comprising molding compound having extended portion and manufacturing method of semiconductor package | Po-Han Wang, Hung-Jui Kuo | 2020-01-07 |