Issued Patents All Time
Showing 176–200 of 202 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090254 | Wafer alignment methods in die sawing process | Ming-Da Cheng, Chung-Shi Liu | 2018-10-02 |
| 10082596 | Vehicle inspection system | Jianmin Li, Hui Meng, Yuan Ma, Weifeng Yu, Jinning Liang +1 more | 2018-09-25 |
| 10074026 | Vehicle type recognition method and fast vehicle checking system using the same method | Shangmin Sun, Yanwei Xu, Qiang Li, Weifeng Yu | 2018-09-11 |
| 10068853 | Integrated fan-out package and method of fabricating the same | Hung-Jui Kuo, Yi-Wen Wu | 2018-09-04 |
| 10060901 | Concrete temperature stress testing machine system and temperature deformation self-compensation method | Qingbin Li, He Zhu, Ge Wang | 2018-08-28 |
| 10049889 | Method of fabricating package structures | Chung-Shi Liu, Hung-Jui Kou, Sih-Hao Liao | 2018-08-14 |
| 10049068 | SAS system, SAS system traversal method, and apparatus | Na Wang | 2018-08-14 |
| 10049986 | Package structures and methods of making the same | Zi-Jheng Liu, Chung-Shi Liu, Hung-Jui Kuo | 2018-08-14 |
| 10032735 | Semiconductor structure and method of forming | Chen-Hua Yu, Hung-Jui Kuo | 2018-07-24 |
| 9941221 | Warpage control in package-on-package structures | Wei-Yu Chen, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-04-10 |
| 9899248 | Method of forming semiconductor packages having through package vias | Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin, Hung-Jui Kuo, Ming-Da Cheng | 2018-02-20 |
| 9891208 | Concrete temperature stress testing machine system and concrete temperature stress testing method | Qingbin Li, He Zhu, Ge Wang | 2018-02-13 |
| 9837278 | Wafer level chip scale package and method of manufacturing the same | Wei-Yu Chen, Hung-Jui Kuo, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-12-05 |
| 9817149 | Vehicle inspection system | Jianmin Li, Ying Li, Yuanjing Li, Yulan Li, Tao Song +1 more | 2017-11-14 |
| 9793230 | Semiconductor structure and method of forming | Chen-Hua Yu, Hung-Jui Kuo | 2017-10-17 |
| 9786617 | Chip packages and methods of manufacture thereof | Zi-Jheng Liu, Chen-Cheng Kuo, Chung-Shi Liu, Hung-Jui Kuo | 2017-10-10 |
| 9761551 | Solder joint structure for ball grid array in wafer level package | Wei-Yu Chen, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-09-12 |
| 9741586 | Method of fabricating package structures | Chung-Shi Liu, Hung-Jui Kuo, Sih-Hao Liao | 2017-08-22 |
| 9659805 | Fan-out interconnect structure and methods forming the same | Chung-Shi Liu, Hung-Jui Kuo, Ming-Da Cheng | 2017-05-23 |
| 9570413 | Packages with solder ball revealed through laser | Wei-Yu Chen, Ming-Da Cheng, Hung-Jui Kuo, Chung-Shi Liu | 2017-02-14 |
| 9559064 | Warpage control in package-on-package structures | Wei-Yu Chen, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-01-31 |
| 9449934 | Solder joint structure for ball grid array in wafer level package | Wei-Yu Chen, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-09-20 |
| 9318429 | Integrated structure in wafer level package | Hung-Jui Kuo, Chung-Shi Liu | 2016-04-19 |
| 9318386 | Wafer alignment methods in die sawing process | Ming-Da Cheng, Chung-Shi Liu | 2016-04-19 |
| 8974617 | Method for transferring a graphene sheet to metal contact bumps of a substrate for use in semiconductor device package | Chung-Shi Liu | 2015-03-10 |