Issued Patents All Time
Showing 276–292 of 292 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7662665 | Method for fabricating a semiconductor package including stress relieving layer for flip chip packaging | Chen-Shien Chen, Kuo-Chin Chang, Pei-Haw Tsao, Chung Yu Wang, Han-Liang Tseng +1 more | 2010-02-16 |
| 7656042 | Stratified underfill in an IC package | Mirng-Ji Lii, Tjandra Winata Karta, Chien-Hsiun Lee | 2010-02-02 |
| 7642631 | Packaged semiconductor chip comprising an integrated circuit chip ablated with laser and cut with saw blade from wafer | Hsin-Hui Lee, Ming-Chung Sung, Mirng-Ji Lii | 2010-01-05 |
| 7491624 | Method of manufacturing low CTE substrates for use with low-k flip-chip package devices | Hsin-Hui Lee, Chien-Hsiun Lee, Mirng-Ji Lii | 2009-02-17 |
| 7446424 | Interconnect structure for semiconductor package | Jerry Tzou | 2008-11-04 |
| 7427803 | Electromagnetic shielding using through-silicon vias | Clinton Chao, Chao-Shun Hsu, Mark Shane Peng, Tjandra Winata Karta | 2008-09-23 |
| 7361990 | Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump pads | Hsin-Hui Lee, Chung Yu Wang, Mirng-Ji Lii | 2008-04-22 |
| 7265034 | Method of cutting integrated circuit chips from wafer by ablating with laser and cutting with saw blade | Hsin-Hui Lee, Ming-Chung Sung, Mirng-Ji Lii | 2007-09-04 |
| 7170159 | Low CTE substrates for use with low-k flip-chip package devices | Hsin-Hui Lee, Chien-Hsiun Lee, Mirng-Ji Lii | 2007-01-30 |
| 6605525 | Method for forming a wafer level package incorporating a multiplicity of elastomeric blocks and package formed | Ming Lu, Jyh-Rong Lin | 2003-08-12 |
| 6596611 | Method for forming wafer level package having serpentine-shaped electrode along scribe line and package formed | Ming Lu | 2003-07-22 |
| 6539624 | Method for forming wafer level package | Ling-Chen Kung, Kuo-Chuan Chen, Ruoh-Huey Uang | 2003-04-01 |
| 6440836 | Method for forming solder bumps on flip chips and devices formed | Ling-Chen Kung, Ruoh-Huey Uang, Hsu-Tien Hu | 2002-08-27 |
| 6365498 | Integrated process for I/O redistribution and passive components fabrication and devices formed | Tsung-Yao Chu, Ying-Nan Wen | 2002-04-02 |
| 6358836 | Wafer level package incorporating elastomeric pads in dummy plugs | Kuo-Chuan Chen, Jyh-Rong Lin, Ruoh-Huey Wang, Hsu-Tien Hu, Hsin-Chien Huang | 2002-03-19 |
| 6268114 | Method for forming fine-pitched solder bumps | Ying-Nan Wen, Ling-Chen Kung, Ruoh-Huey Uang | 2001-07-31 |
| 6179200 | Method for forming solder bumps of improved height and devices formed | Ling-Chen Kung, Hsu-Tien Hu, Ruoh-Huey Uang, Chun-Yi Kuo | 2001-01-30 |