Issued Patents All Time
Showing 51–75 of 365 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990400 | Capping layer overlying dielectric structure to increase reliability | Ting-Ya Lo, Chi-Lin Teng, Hai-Ching Chen, Hsin-Yen Huang, Shao-Kuan Lee +1 more | 2024-05-21 |
| 11972975 | Semiconductor device structure having air gap and method for forming the same | Hsi-Wen Tien, Wei-Hao Liao, Yu-Teng Dai, Hsin-Chieh Yao, Chih Wei Lu +1 more | 2024-04-30 |
| 11967552 | Methods of forming interconnect structures in semiconductor fabrication | Ming-Han Lee | 2024-04-23 |
| 11948834 | Selective deposition of barrier layer | Hsin-Yen Huang, Hai-Ching Chen | 2024-04-02 |
| 11935783 | Selective deposition for integrated circuit interconnect structures | Hsin-Yen Huang, Shao-Kuan Lee, Cheng-Chin Lee, Hai-Ching Chen | 2024-03-19 |
| 11929326 | Method of forming graphene barrier layer in interconnect structure | Shin-Yi Yang, Ming-Han Lee | 2024-03-12 |
| 11929258 | Via connection to a partially filled trench | Shih-Ming Chang, Chih-Ming Lai, Ru-Gun Liu, Tsai-Sheng Gau, Chung-Ju Lee +1 more | 2024-03-12 |
| 11923306 | Semiconductor structure having air gaps and method for manufacturing the same | Chia-Wei Su, Chia-Tien Wu, Hsin-Ping Chen | 2024-03-05 |
| 11923243 | Semiconductor structure having air gaps and method for manufacturing the same | Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee +1 more | 2024-03-05 |
| 11908794 | Protection liner on interconnect wire to enlarge processing window for overlying interconnect via | Shin-Yi Yang, Hsin-Yen Huang, Ming-Han Lee, Yu-Chen Chan, Meng-Pei Lu | 2024-02-20 |
| 11908792 | Semiconductor device comprising cap layer over dielectric layer and method of manufacture | Shao-Kuan Lee, Hai-Ching Chen, Hsin-Yen Huang, Cheng-Chin Lee | 2024-02-20 |
| 11908789 | Selective formation of conductor nanowires | Chao-Hsien Peng, Hsiang-Huan Lee | 2024-02-20 |
| 11901349 | Semiconductor packages and methods for forming the same | Han-Tang Hung, Shin-Yi Yang, Ming-Han Lee | 2024-02-13 |
| 11901221 | Interconnect strucutre with protective etch-stop | Shao-Kuan Lee, Hai-Ching Chen, Hsin-Yen Huang, Cheng-Chin Lee | 2024-02-13 |
| 11894238 | Method of fabricating semiconductor device with reduced trench distortions | Yung-Sung Yen, Chung-Ju Lee, Chun-Kuang Chen, Chia-Tien Wu, Ta-Ching Yu +4 more | 2024-02-06 |
| 11894266 | Metal capping layer and methods thereof | Shao-Kuan Lee, Cheng-Chin Lee, Hsin-Yen Huang, Hai-Ching Chen | 2024-02-06 |
| 11860550 | Multi-metal fill with self-aligned patterning and dielectric with voids | Tai-I Yang, Wei-Chen Chu, Hsiang-Wei Liu, Li-Lin Su, Yung-Hsu Wu | 2024-01-02 |
| 11854820 | Spacer etching process for integrated circuit design | Ru-Gun Liu, Cheng-Hsiung Tsai, Chung-Ju Lee, Chih-Ming Lai, Chia-Ying Lee +6 more | 2023-12-26 |
| 11854944 | Semiconductor packages and methods for forming the same | Shin-Yi Yang, Ming-Han Lee | 2023-12-26 |
| 11854963 | Semiconductor interconnection structure and methods of forming the same | Shao-Kuan Lee, Kuang-Wei YANG, Cherng-Shiaw Tsai, Cheng-Chin Lee, Ting-Ya Lo +3 more | 2023-12-26 |
| 11854987 | Semiconductor packages with interconnection features in a seal region and methods for forming the same | Ming-Han Lee, Shin-Yi Yang | 2023-12-26 |
| 11848190 | Barrier-less structures | Hsin-Ping Chen, Yung-Hsu Wu, Chia-Tien Wu, Min Cao, Ming-Han Lee +1 more | 2023-12-19 |
| 11810815 | Dielectric capping structure overlying a conductive structure to increase stability | Hsin-Yen Huang, Chi-Lin Teng, Hai-Ching Chen, Shao-Kuan Lee, Cheng-Chin Lee +1 more | 2023-11-07 |
| 11769695 | Semiconductor structure including low-resistance interconnect and integrated circuit device having the same | Hsin-Yen Huang, Shao-Kuan Lee, Cheng-Chin Lee, Hsiang-Wei Liu, Tai-I Yang +2 more | 2023-09-26 |
| 11764106 | Semiconductor device and method of manufacture | Tai-I Yang, Wei-Chen Chu, Yung-Chih Wang, Chia-Tien Wu, Hsin-Ping Chen | 2023-09-19 |