Issued Patents All Time
Showing 326–350 of 425 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510701 | Semiconductor die connection system and method | Chen-Hua Yu, Sen-Bor Jan | 2019-12-17 |
| 10504873 | 3DIC structure with protective structure and method of fabricating the same and package | Hsien-Wei Chen, Ching-Jung Yang | 2019-12-10 |
| 10504776 | Methods for forming through-substrate vias penetrating inter-layer dielectric | Yu-Young Wang, Sen-Bor Jan | 2019-12-10 |
| 10483187 | Heat spreading device and method | Chen-Hua Yu, Wensen Hung, Tsung-Yu Chen | 2019-11-19 |
| 10483174 | Integrated circuit component and package structure having the same | Tzuan-Horng Liu, Chao-Hsiang Yang, Hsien-Wei Chen | 2019-11-19 |
| 10475762 | 3DIC structure and method of manufacturing the same | Sung-Feng Yeh, Hsien-Wei Chen | 2019-11-12 |
| 10468379 | 3DIC structure and method of manufacturing the same | Tzuan-Horng Liu, Hsien-Wei Chen, Jiun-Heng Wang | 2019-11-05 |
| 10381298 | Packages with Si-substrate-free interposer and method forming same | Chen-Hua Yu, Sung-Feng Yeh, Hsien-Wei Chen | 2019-08-13 |
| 10373885 | 3D stacked-chip package | Chen-Hua Yu, Wen-Sen Lu, Wen-Chih Chiou, Wen-Ching Tsai | 2019-08-06 |
| 10347607 | Semiconductor devices and methods of manufacture thereof | Ching-Pin Yuan, Chen-Hua Yu | 2019-07-09 |
| 10325865 | Semiconductor structure and manufacturing method thereof | Ying-Ju Chen, Hsien-Wei Chen | 2019-06-18 |
| 10319707 | Semiconductor component, package structure and manufacturing method thereof | Hsien-Wei Chen, Sung-Feng Yeh, Chi-Hwang Tai | 2019-06-11 |
| 10312201 | Seal ring for hybrid-bond | Chih-Chia Hu, Chun-Chiang Kuo, Sen-Bor Jan, Hsien-Wei Chen | 2019-06-04 |
| 10297550 | 3D IC architecture with interposer and interconnect structure for bonding dies | Hsien-Pin Hu, Chen-Hua Yu, Jing-Cheng Lin, Jiun-Ren Lai, Yung-Chi Lin | 2019-05-21 |
| 10290571 | Packages with si-substrate-free interposer and method forming same | Chen-Hua Yu, Sung-Feng Yeh, Hsien-Wei Chen | 2019-05-14 |
| 10269741 | Bond structures and the methods of forming the same | Chen-Hua Yu, Wen-Chih Chiou, Yi-Hsiu Chen | 2019-04-23 |
| 10222307 | Mixing and transfer device for materials used in biological and biochemical assays | Jr Winston Wong, Stephen Chang-Chi Kao, Ying-Ta Lai, Sheng-Pin Hsiao | 2019-03-05 |
| 10163750 | Package structure for heat dissipation | Chen-Hua Yu, Sung-Feng Yeh | 2018-12-25 |
| 10163859 | Structure and formation method for chip package | Chen-Hua Yu, Sung-Feng Yeh | 2018-12-25 |
| 10163799 | Semiconductor structure and method of manufacturing the same | Sung-Feng Yeh | 2018-12-25 |
| 10157890 | Semiconductor structure and method of manufacturing the same | Chen-Hua Yu, Sung-Feng Yeh | 2018-12-18 |
| 10157867 | Interconnect structure and method | Ying-Ju Chen, Chen-Hua Yu, Hsien-Wei Chen, Chih-Chia Hu | 2018-12-18 |
| 10157882 | 3D chip-on-wafer-on-substrate structure with via last process | Chen-Hua Yu, Wen-Ching Tsai, Sung-Feng Yeh | 2018-12-18 |
| 10147704 | Semiconductor devices and methods of manufacturing thereof | Ching-Pin Yuan, Chen-Hua Yu | 2018-12-04 |
| 10096571 | Chip-on-wafer package and method of forming same | Chen-Hua Yu, Sung-Feng Yeh | 2018-10-09 |