Issued Patents All Time
Showing 376–400 of 425 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9548274 | Reticle for non-rectangular die | Chen-Hua Yu, Sung-Feng Yeh | 2017-01-17 |
| 9524959 | System on integrated chips and methods of forming same | Sung-Feng Yeh, Chen-Hua Yu | 2016-12-20 |
| 9520340 | Semiconductor die connection system and method | Chen-Hua Yu, Sen-Bor Jan | 2016-12-13 |
| 9508703 | Stacked dies with wire bonds and method | Chen-Hua Yu, Sung-Feng Yeh, Meng-Tse Chen, Hui-Min Huang, Hsiu-Jen Lin +2 more | 2016-11-29 |
| 9449875 | Wafer backside interconnect structure connected to TSVs | Wen-Chih Chiou, Shau-Lin Shue | 2016-09-20 |
| 9449837 | 3D chip-on-wafer-on-substrate structure with via last process | Chen-Hua Yu, Wen-Ching Tsai | 2016-09-20 |
| 9373673 | 3-D inductor and transformer | Hsiao-Tsung Yen, Chin-Wei Kuo, Hsien-Pin Hu, Sally Liu, Jhe-Ching Lu | 2016-06-21 |
| 9355935 | Connecting through vias to devices | Yu-Young Wang, Sen-Bor Jan | 2016-05-31 |
| 9331021 | Chip-on-wafer package and method of forming same | Chen-Hua Yu, Sung-Feng Yeh | 2016-05-03 |
| 9236311 | Controlling the device performance by forming a stressed backside dielectric layer | I-Ching Lin | 2016-01-12 |
| 9219046 | Strength of micro-bump joints | Wen-Wei Shen, Chen-Shien Chen, Chen-Cheng Kuo, Rung-De Wang | 2015-12-22 |
| 9153540 | Semiconductor die connection system and method | Chen-Hua Yu, Sen-Bor Jan | 2015-10-06 |
| 9142533 | Substrate interconnections having different sizes | Wen-Wei Shen, Ying-Ching Shih, Chen-Shien Chen | 2015-09-22 |
| 9123702 | Connecting through vias to devices | Yu-Young Wang, Sen-Bor Jan | 2015-09-01 |
| 9064940 | Through-silicon via with low-K dielectric liner | — | 2015-06-23 |
| 9059026 | 3-D inductor and transformer | Hsiao-Tsung Yen, Chin-Wei Kuo, Hsien-Pin Hu, Sally Liu, Jhe-Ching Lu | 2015-06-16 |
| 8946084 | Controlling the device performance by forming a stressed backside dielectric layer | I-Ching Lin | 2015-02-03 |
| 8901736 | Strength of micro-bump joints | Wen-Wei Shen, Chen-Shien Chen, Chen-Cheng Kuo, Rung-De Wang | 2014-12-02 |
| 8859424 | Semiconductor wafer carrier and method of manufacturing | Yung-Jean Lu, Chen-Shien Chen, Jao Sheng Huang | 2014-10-14 |
| 8820728 | Semiconductor wafer carrier | Jao Sheng Huang | 2014-09-02 |
| 8816491 | Stacked integrated chips and methods of fabrication thereof | Jao Sheng Huang | 2014-08-26 |
| 8803292 | Through-substrate vias and methods for forming the same | Yu-Young Wang, Sen-Bor Jan | 2014-08-12 |
| 8791549 | Wafer backside interconnect structure connected to TSVs | Wen-Chih Chiou, Shau-Lin Shue | 2014-07-29 |
| 8716131 | Through silicon via layout | Chen-Shien Chen | 2014-05-06 |
| 8643149 | Stress barrier structures for semiconductor chips | — | 2014-02-04 |