Issued Patents All Time
Showing 401–425 of 425 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8624324 | Connecting through vias to devices | Yu-Young Wang, Sen-Bor Jan | 2014-01-07 |
| 8546235 | Integrated circuits including metal-insulator-metal capacitors and methods of forming the same | Sung-Hui Huang, Yuan-Hung Liu | 2013-10-01 |
| 8546886 | Controlling the device performance by forming a stressed backside dielectric layer | I-Ching Lin | 2013-10-01 |
| 8518796 | Semiconductor die connection system and method | Chen-Hua Yu, Sen-Bor Jan | 2013-08-27 |
| 8501587 | Stacked integrated chips and methods of fabrication thereof | Jao Sheng Huang | 2013-08-06 |
| 8471358 | 3D inductor and transformer | Hsiao-Tsung Yen, Chin-Wei Kuo, Hsien-Pin Hu, Sally Liu, Jhe-Ching Lu | 2013-06-25 |
| 8453318 | Method for making a planar coil | Hung-Yi Lin | 2013-06-04 |
| 8436448 | Through-silicon via with air gap | — | 2013-05-07 |
| 8399354 | Through-silicon via with low-K dielectric liner | — | 2013-03-19 |
| 8378480 | Dummy wafers in 3DIC package assemblies | Chia-Yen Lee | 2013-02-19 |
| 8362591 | Integrated circuits and methods of forming the same | Hsiao-Tsung Yen, Hsien-Pin Hu, Jhe-Ching Lu, Chin-Wei Kuo, Sally Liu | 2013-01-29 |
| 8310328 | Planar coil and method of making the same | Hung-Yi Lin | 2012-11-13 |
| 8288872 | Through silicon via layout | Chen-Shien Chen | 2012-10-16 |
| 8241963 | Recessed pillar structure | Wen-Wei Shen, Yao-Chun Chuang, Chen-Shien Chen | 2012-08-14 |
| 8222139 | Chemical mechanical polishing (CMP) processing of through-silicon via (TSV) and contact plug simultaneously | I-Ching Lin | 2012-07-17 |
| 8174124 | Dummy pattern in wafer backside routing | Ming-Yen Chiu, Hsien-Wei Chen, Shin-Puu Jeng | 2012-05-08 |
| 8158456 | Method of forming stacked dies | Chen-Shien Chen, Wen-Chih Chiu | 2012-04-17 |
| 8053902 | Isolation structure for protecting dielectric layers from degradation | Sheng Lin | 2011-11-08 |
| 8049327 | Through-silicon via with scalloped sidewalls | Chen-Cheng Kuo, Chih-Hua Chen, Chen-Shien Chen | 2011-11-01 |
| 7957821 | Systems and methods for statistical process control | Ming-Chang Huang | 2011-06-07 |
| 7910473 | Through-silicon via with air gap | — | 2011-03-22 |
| 7026580 | Adjustable exhaust flow for thermal uniformity | Yao-Hwan Kao, Jia-Sheng Lee, De-Yuan Lu | 2006-04-11 |
| 6340547 | Method of forming circuit patterns on semiconductor wafers using two optical steppers having nonaligned imaging systems | Chih-Chien Hung, Chia-Hsiang Chen, Fu-Tien Wong | 2002-01-22 |
| 5999397 | Method for preventing electrostatic discharge damage to an insulating article | Shih-Shiung Chen, Ying-Chen Chao | 1999-12-07 |
| 5989754 | Photomask arrangement protecting reticle patterns from electrostatic discharge damage (ESD) | Shih-Shiung Chen, Ho-Ku Lan, Ying-Chen Chao | 1999-11-23 |